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WORLD OF TECHNOLOGY & SCIENCE
September 27th – 30th Jaarbeurs Utrecht |
It is our pleasure to inform you that Accelonix is exhibiting at the WoTS 2022 tradeshow. The event will take place from September 27th up to 30th at the Jaarbeurs in Utrecht. We kindly invite you to visit the exhibition and Accelonix at booth 9C014, Hall 9 Meet up with one of our representatives and be informed about our newest products latest innovations and Accelonix services in the field of EMC & RF, Microelectronics Packaging, PCBA Inspection & Test and Metrology. For a free entrance ticket please click here for registration. |
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Direct links to the equipment that we will demonstrate: |
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| Tresky AG : New Generation Die Bonder / Micro assembly systems demonstrations |
 | Discover the Tresky T-5100 manual die bonder with True Vertical Technology™. Epoxy, eutectic-solder, flip chip, sinter: one system to support all die attach processes. The T-5100 is a universal manual die bonder suitable for a wide range of micro-assembly tasks. The equipment features a superior ergonomic design, high accuracy, a large 220 x 220mm assembly area with 125 mm of vertical travel and an integrated time/pressure dispenser, making it ideal for R&D through low volume production or custom assembly. |
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| Comet YXLON : X-Ray Inspection Demostrations |
 | Discover the Comet YXLON Cougar EVO at the Accelonix booth. Bring your sample and make the invisible visible! The EVO Series was designed to provide the “best-in-class” inspection solutions for SMT, semiconductor, and laboratory assembly applications, while maintaining a small system footprint for maximum convenience. With optimized software and hardware, these systems produce higher quality and more consistent results than other electronics inspection systems currently on the market. |
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TPT and Hesse Mechatronics: Wire Bonding Solutions |
 | Discover the features of the new generation Hesse Mechatronics Automatic Wire Bonding Machines on our 2D Bonder Simulator. Fine Wire Wedge & Ball Bonding, Heavy Wire Battery Bonding! Meet our representatives to learn more about our Wire Bonding Solutions and Wire Bonding Services we offer for microelectronics and battery packs. With our wide range of manual/semi-automatic and full automatic demo wire bonders we can offer local machine demonstrations and perform sample wire bonding from our Eindhoven based demolab. |
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| Aster Technologies : EMS4.0 Software Solutions Demonstrations |
 | Aster Technologies EMS4.0 Software Solutions New Product Manufacturing, Traceability and Repair Software from CAD to PCBA If you are looking for a manufacturing automation software to speed up the process of bringing a new PCBA from CAD to your production or a solution to keep track of traceability and shorten the repair cycle, then visit Accelonix booth for a demonstration. |
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| EM Test and TESEQ : EMC Generators Demonstrations |
 | Discover the EM Test and TESEQ EMC Generators We will demonstrate the following simulators for ESD, Surge/Burst/PQT and RF conducted and radiated immunity test: EM Test NX30, EM Test Compact NX5 and Teseq NSG 4070 |
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