Tresky Automation announces Accelonix as distributor


We are very pleased to announce that TRESKY Automation appointed Accelonix as distributor for their Automated pick-and-place Systems for the Benelux, covering the Netherlands, Belgium and Luxembourg.

Since 1980 Tresky manufacturers Die Bonding Systems optimal for R&D, pilot and medium size production. With numerous available options, and known for highest quality requirements and maximum reliabilty the bonders can be customized to best suit your needs. Tresky stands for innovative and customized solutions for the high-precision assembly of electronic semiconductor components, also known as DIE Bonding.

  • Extremely precise bonding despite a large bonding area.
  • Very flexible modular setup can be adapted to any bonding process easily.
  • ‘Manual mode’ is a unique feature which enables you to bond without the need to program.
  • Epoxy bonding, Eutectic bonding, Ultrasonic bonding, Thermocompression bonding, Flip-chip bonding, Pick & place

TRESKY´s  T-Series impress with highly flexible solutions that are constantly being developed and are therefore always one step ahead. Thanks to the modular and flexible machine concept combined with numerous advanced options, Tresky enables their customers to react as quickly as possible to new technologies, product requirements, and new market situations.

The T-6000-L Die Bonder is an all-purpose system for R&D, pilot-, and medium-size production. With numerous available options, the T-6000-L can be customized to best suit all market needs.
The T-6000-L/G DIE Bonder is an enhanced version of the proven T-6000-L series. A fully all-purpose system built on a sophisticated granite gantry for an even more precise placement accuracy.
The T-8000-G Die Bonder is a fully-automated all-purpose system built on a granite mainframe. Developed for a higher throughput and more accuracy, best fit for medium sized production.

Direct link to Applications (Chapters) shown in this video:

00:17 Conveyer / Indexer
01:27​ Stamping
02:01​ Chip to 12” Wafer
02:38 Fine Pitch Stamping
06:24​ Automatic Tool Change
06:31​ Pick & Place
06:53 Eutectic Scrubbing
08:13​ Die Stacking
09:21Ultrasonic Bonding
09:54​ Bonding TO CAN
13:35​ Glas Frit Bonding
15:10​ UV Indexer
15:26​ Customized Applications

For more information on the TRESKY Automated systems please click here.

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