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T-8000-G : Flexible Automatic Die Bonder

The T-8000-G Die Bonder is a fully-automated all-purpose system built on a granite mainframe.

Developed for a higher throughput and more accuracy, best fit for medium sized production.

This platform offers a large working area especially for 12“ wafer handling.

Open, with a wide range of applications and numerous available options, the T-8000-G can be customized to best suit all market needs.

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T-8000-G : Flexible Automatic Die Bonder

The T-8000-L Die Bonder is a fully-automated all-purpose system built on a granite mainframe. Developed for a higher throughput and more accuracy, best fit for medium sized production.
This platform offers a large working area especially for 12“ wafer handling. Open, with a wide range of applications and numerous available options, the T-8000-G can be customized to best suit all market needs.

 

Tresky Automation : T-8000-L

T-Series Options

Direct link to Applications (Chapters) shown in this video:
00:00Start
00:17 Conveyer / Indexer
01:06Dispensing
01:27​ Stamping
02:01​ Chip to 12” Wafer
02:38 Fine Pitch Stamping
06:24​ Automatic Tool Change
06:31​ Pick & Place
06:53 Eutectic Scrubbing
07:01Eutectic
08:13​ Die Stacking
09:21Ultrasonic Bonding
09:54​ Bonding TO CAN
13:35​ Glas Frit Bonding
15:10​ UV Indexer
15:26​ Customized Applications

Download Datasheet

Tresky Automation : T-8000-L Datasheet
Tresky Automation : T-Series Overview Datasheet

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