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T-6000-L : Flexible Automatic Die Bonder

The T-6000-L Die Bonder is a fully-automated all-purpose system for medium sized-, pilot- and R&D production.

Equipped with linear motors and 0.1 µm resolution glass scales, this enables a movement precision of 8 µm @ 3Sigma.

A force range of 15g up to 800g, combined with the large working area of 495 x 400 mm and wafer handling up to 8“, offers a wide range of applications.

With numerous available options, the T-6000-L can be customized to best suit all market needs.

 

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T-6000-L Flexible Automatic Die Bonder

The T-6000-L Die Bonder is a fully-automated all-purpose system for medium sized-, pilot- and R&D production. Equipped with linear motors and 0.1 µm resolution glass scales, this enables a movement precision of 8 µm @ 3Sigma. A force range of 15g up to 800g, combined with the large working area of 495 x 400 mm and wafer handling up to 8“, offers a wide range of applications. With numerous available options, the T-6000-L can be customized to best suit all market needs.

Tresky Automation : T-6000-L Flexible Automatic Die Bonder

T-Series Options

Direct link to Applications (Chapters) shown in this video:
00:00Start
00:17 Conveyer / Indexer
01:06Dispensing
01:27​ Stamping
02:01​ Chip to 12” Wafer
02:38 Fine Pitch Stamping
06:24​ Automatic Tool Change
06:31​ Pick & Place
06:53 Eutectic Scrubbing
07:01Eutectic
08:13​ Die Stacking
09:21Ultrasonic Bonding
09:54​ Bonding TO CAN
13:35​ Glas Frit Bonding
15:10​ UV Indexer
15:26​ Customized Applications

Download Datasheet

Tresky Automation : T-6000-L Datasheet
Tresky Automation : T-Series Overview Datasheet

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