Wire Bonding and Bond Testing Workshop – June 6
June 6, 2023 – Eindhoven
Keep up to date with the newest trends in wire bonding technology and participate in this technology workshop.
Manual and automated wire bonding systems will be presented and demonstrated.
Date: June 6, 2023 from 10:00 to 14:00
Venue: Accelonix BV, Luchthavenweg 18-b, 5657EB Eindhoven
Registration is required: Register here
Agenda:
Hesse BJ653 Automatic Wire Bonder
Full automatic Wirebonder with Wedge, BallBonding and Heavy wire Bondheads.
- General hardware and software introduction
- Wire Bonding Demonstration
- Hesse Highlights
- Pattern recognition features
- E-Box
TPT HB16 Semi-Automatic Wire Bonder
Semi-Automatic Wire Ball, Wedge, Bump and Ribbon Wire Bonder
- General hardware and software introduction
- Wire Bond Demonstrations
- TPT Highlights
Multi-test Bondtester performs most used microelectronics test applications, with manual positioning stage for higher productivity.
- General hardware and software introduction
- Fine Wire Pulltest
- Ballbond Sheartest
- Thick Wire Sheartest.
Accelonix Benelux offers X-Ray and uCT Inspection Services with our new YXLON
- Introduction of Accelonix X-Ray Services
- Live Demo of inspection of Microelectronics component.
