Accelonix TechDay 2024: Micro & Power Electronics Assembly
Tuesday May 28th, 2024 – Eindhoven 📢 You’re Invited! Join us on May 28th at the Accelonix Office in Eindhoven for an exciting workshop! Are your interested to learn more … Read more
Tuesday May 28th, 2024 – Eindhoven 📢 You’re Invited! Join us on May 28th at the Accelonix Office in Eindhoven for an exciting workshop! Are your interested to learn more … Read more
Wire Bonding and Bond Testing Workshop – June 6 June 6, 2023 – Eindhoven Keep up to date with the newest trends in wire bonding technology and participate in this … Read more
Accelonix is proud to be a bronze partner of the Hydro Motion Team of the Technical University of Delft. The Hydro Motion Teams will compete in the Open Sea Class … Read more
Bond testing is necessary to evaluate the wire bonding quality and to confirm the consistency and reliability of the bonds in microelectronic assemblies and packages. The test evaluates the integrity … Read more
A closer look at wire bonding (by Christian Ruoff) Prior to writing his article addressing the future of battery bonding, author Christian Ruoff talked to wire bonding experts of Hesse … Read more