Bond testing is necessary to evaluate the wire bonding quality and to confirm the consistency and reliability of the bonds in microelectronic assemblies and packages. The test evaluates the integrity of the wire loops or solder balls that form connections between the silicon chip and the external leads of the semiconductor device to the substrate. The force required to break the bond is measured and recorded. The type of bond failure is also recorded according to a grade code grading scheme that depends on the type of bond test.
Wire or ribbon pull testing assesses the wire bond strength and quality. In this test, an upward force is applied by a pull hook under the wire, effectively pulling the wire away from the die. The pull hook is normally positioned at the highest point along the loop of the wire, and the pulling force is applied perpendicular to the die surface.
Tweezer pull testing assesses the strength of the solder bump connection between the flip chip die and the substrate. In this test, a tweezer tool grips the solder bump and attempts to pull it away from the substrate. The force required to pull the bump from the substrate is measured and together with the faillure mode ( First bond lift, Pad lift, Cratering ) recorded.
Ball shear testing is a complementary test for assessing the strength of a bond. In this test, a chisel‐shaped shear tool is placed against the edge of the ball bond and a horizontal force is applied. The force required to shear the ball from the pad is measured and recorded together with the faillure mode ( First bond lift, Ball shear, Pad lift, Cratering) recorded.
Die shear testing assesses the overall quality of the die attach process, including the integrity of the materials and the capabilities of the processes used in mounting the die to the package substrate. In this test, a shear tool makes contact with the full length of the die edge to apply a force uniformly from one end of the edge to the other. The force must be applied perpendicular to the die edge and parallel to the die attach or substrate plane. The force required to shear the die from the substrate is then measured and recorded. Common die shear failures are Die interface break, Die fracture, Substrate interface break.
The Royce bond testers support a full range of pull and shear test applications with wires of different materials (Au, Al, Cu) and with various diameters. Die shear as well as custom testing applications are also possible. Exchangeable test modules and a wide range of test piece holders are available to support almost all bond test requirements. The Royce embedded Bond Test Manager software operating system is a powerful yet easy to use interface to record bond test parameters, inspect and report the faillure mode and perform in depth analysis of the recorded data.
|650 Universal Bond Tester
Applications performed by the Royce 650 include: wire pull, ball bond shear, die shear, solder ball (bump) shear, zone shear, tweezer pull, stud pull, die strength 3- point bend (push) test, heated testing, and custom testing to user specifications.
|620 Multi-test Bond Tester
The Royce 620 Multitest Bond Tester offers an attractive midway bond test solution. It performs all of the most frequently used applications, such as: wire pull, ball bond shear, solder ball (bump) shear, tweezer pull, stud pull. The 620 employs manual sample positioning, which in some applications allows for higher productivity over a motorized XY stage.