The Bondjet BJ935/939 is an ultrasonic wedge-wedge bonder developed for the fully automated processing of a wide range of substrates, chips and other materials. The system can be used as a fully automatic machine or operated manually.
The Hesse GmbH as technology leader has designed the only heavy wire bondhead with non destructive pull test and a unique transducer integrated sensor for 100% quality monitoring in real-time. Further outstanding features are high speed and the largest bonding area. Advanced features available on Bondjet BJ935/939 are designed to meet your present and future requirements and greatly enhance productivity.
Active Cutting: repeatable, precise, programmable cutting depth
Air Cut: No impact on surface, e.g. for highly sensitive chips because of „touch-free“ cutting
Passive Cutting
E-Box: patented solution for optimized tool change and programmable alignment marks for guide, cutter and bond wedge
Flexibility
Working area BJ935: 254 mm x 244 mm (10″ x 9.6″)
Working area BJ939: 350 mm x 560 mm (13.8″ x 22.0″)
Flexible use of the large working area, e.g. vacuum-clamping of up to six 5″ x 7″ standard DCBs
Maximization of throughput by automation with two or more parallel lanes
Quality
Continuous real time monitoring of wire deformation, transducer current and frequency within programmable control limits
Process integrated Quality Control PiQC – integrated in Hesse Mechatronics‘ Workbench: detection of further parameters by additional sensor system(e.g. friction) for 100% quality monitoring in real time (patented)
Remote pull function on PiQC threshold value for optimized cycle time; up to 30 % safe on equipment
Integrated, non-destructive pulltest for wire and ribbon
PBS200 – server for central data management
BDE, traceability – in PBS200 integrated XML interface or customized implementation
SECS/GEM – in PBS200 integrated standardized server connection for automation and communication
MES – interface to Manufacturing Execution Systems, integrated or in PBS200 realized, customized implementation
Speed
Highest UPH due to linear motors for bonder and indexer
Working area
BJ935: X: 254 mm (10″); Y: 244 mm (9.6″); Z: 70 mm (2.75″)
BJ939: X: 350 mm (13.8″); Y: 560 mm (22.0″); Z: 70 mm (2.75″)
P-rotation: 440°
Cutting methods
active, passive, air cut (for frontcut)
Ultrasonics
Digital ultra-sound generator with PLL (Phase-Locked-Loop), internal frequency resolution <1 Hz
Ribbon Al, Cu, AlCu: 250 µm x 25 µm up to 2000 µm x 400 µm (Cu: 200 µm) (10 mil x 1 mil up to 80 mil x 16 mil)
Bonding force: 5000 cN adjustable
Wedge length: 2.622″
Heavy Wire Bondhead RBK01 Copper
Type Copper: RBK01 Froncut, Backcut
Transducer (bond frequency): 57 kHz
Wire: Cu : 50 µm – 600 µm (2 mil – 24 mil)
Bonding force: 5000 cN adjustable
Wedge length: 2.733″
E-Box
E-Box
E-Box
Adjustment tool for wire bonders
The E-Box of the Hesse GmbH is a patent-registered visualisation system for control supported, reproducible adjustments of bondhead elements. It includes a camera for optical displaying of wedge, cutter and wire guide as well as a graphical support for adjustment- and positioning control. E-Box allows significant time reduction for setting up the machine. Software enhanced optical adjustment system for wedge, cutter and wire guide / wire clamp.
E-Box for Bonder – Advantages during Production
Better reproducibility of the adjustment depending attributes (e.g. loop forming) after change of wearing parts
Longer life time of wearing parts
Advantages for Bond Process
System for reproducible set-up of wedge, cutter and wire guide / wire clamp
Set-up without microscope
Free programmable, specified positions for bondhead elements
shown as limitation line
different views selectable (different sides, bottom, front etc.)
Minimizes time expenditure for set-up work, set-up control and readjustment
Process secured adjustment of wire feed elements (wedge, wire clamp, wire guide, cutter etc.)
Graphical supported, visual control of
wedge and wire guide position
distance between wedge and wire clamp
gap of wire clamp
wire pass
cutter respectively cutting position
Process integrated Quality Control system PiQC
PiQc
PiQc
The Hesse GmbH has implemented a new Process integrated Quality Control system (PiQC) that is unique to the global wire bonding market. A sensor integrated into the Transducer allows for the first time a multi-dimensional signal analysis of the bond process. PiQC calculates a bond quality index value in realtime, using significant signals from the wire-bonding process.
Advantages for volume production
Inspection of every bond
No mechanical load of the bond connection
Product specific configuration of the quality control system
Feedback from the process
Mechanical oscillation of the wedge
Friction at bond surface
Transducer current
Ultrasonic frequency progression
Wire deformation
Quality statements by PiQC
PiQC calculates a quality index for each bond based on the actual feedback signal from the process
The signal related components of the quality index can be displayed graphically at any time
Teach mode for reference data
Detailed automatic analysis of the welding process
Extraction of process-specific reference data
PBS200 - Wire Bonder Server
The PBS200 Wire Bonder Server is a Windows based system to connect up to 20 Hesse Mechatronics wire bonders at your factory. You can supervise and administrate the machines while production is running. With PBS200 you will have perfect integration of your wire bonders in the production system. The wire bonders communicate with PBS200 Server over the powerful XML based PBS network protocol.
Features of PBS200
Backup all the data of all connected wire bonders
User Administration and assignment of user accounts to wire bonders or production lines
Process Data in real time, ability to store the process data you need and import in Microsoft Excel (Option)
Masterprogramming
Customization PBS200 can be enhanced according to specific customer requirements for traceability or an MES Server connection (Option). Allow the MES system to decide, what process program is used, store the process results in your MES system. Implement your rework strategy on the Wire Bonders
SECS/GEM – compliant module is available for PBS200 (Option)
Multi Server: Run multiple PBS200 Servers and administrate all with the PBS Workbench in your office
PBS200 includes
PBS200 Client license for one wire bonder
PBS200 Hardware with Windows 7 Professional™ and 2 network adaptors
PBS200 Server license for one server
PBS & PiQC Workbench with USB stick license key
Available Process Data
Logbook Data
Machine Configuration
Important Program Parameters
Device ID and Bond Position
PiQC Quality Values
Deformation and Current Charts
Material and Tool Counters
Statistical Data
Automation
The precise and safe handling of the products in and out of the production machine plays a significant role in controlling the product quality, yield and efficiency of the production equipment. For this reason Hesse GmbH is offering automation concepts individually adapted for every application.
The portfolio of automation components for our machines consists of the following groups:
Indexer / Transport system
Bonding Station
Magazine Lifts
Visualization
MES Interface
All our machines are suitable for integration into production lines. This also applies to indexers and magazine lifts, which generally communicate to neighbouring systems by SMEMA interface. The customer specific special solutions which differ from the standard, have lead to some extraordinary optional features, such as:
Indexer with automatic rail width adjustment
Indexer with tilt function for bonding 3-dimensional MID’s
Integrated barcode scanner for automatic program selection
Indexer with 2 or 3 rails for parallel AUER boat processing
Manual heated workholder with adjustable height for maximum flexibility
Magazine lifts with capacity for multiple magazines
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