Discover the TPT HB16 – Semi Automatic fine wire bonder at the Accelonix booth – 7B105 during Electronics & Applications 2023. The HB16 Semi-Automatic series bench top size wire bonder … Read more
Accelonix is proud to be a bronze partner of the Hydro Motion Team of the Technical University of Delft. The Hydro Motion Teams will compete in the Open Sea Class … Read more
Discover the Tresky T-5100 – PC controlled manual die bonder – during WOTS 2022 at the Accelonix booth – 9C014. Epoxy, eutectic-solder, flip chip, sinter: one system to support all … Read more
Microelectronics Technology Webinars April 20th to April 28th, 2021 Keep up to date with the latest solutions in the field of micro electronics assembly, packaging by participating our technology webinars. … Read more
We are very pleased to announce that TRESKY Automation appointed Accelonix as distributor for their Automated pick-and-place Systems for the Benelux, covering the Netherlands, Belgium and Luxembourg. Since 1980 … Read more
On the occasion of Dr. Tresky’s 40th anniversary we are pleased to now introduce the T-4909-AE to the market. Based on the proven predecessor model, we have perfected the T-4909-AE … Read more
Accelonix Benelux has a long history as distributor of ADT (Advanced Dicing Technologies) dicing solutions. ADT offers turnkey dicing solutions optimal for each application, even for the most challenging dicing … Read more
Bond testing is necessary to evaluate the wire bonding quality and to confirm the consistency and reliability of the bonds in microelectronic assemblies and packages. The test evaluates the integrity … Read more
AP+ Automated Die Sorter: New Automatic Inspection Royce Instruments is excited to announce that they have successfully developed an automated inspection package for the AP+with sub-micron resolution and multi-spectrum top … Read more
To address their future demanding wire bond applications, the MICROSYS lab of the University of Liège recently invested in a new Hesse BJ653 automatic wire bonder. This versatile, modular machine … Read more