Accelonix Microelectronics Technology Days 2022

May 30th to June 1st, 2022

Keep up to date with the latest solutions in the field of micro electronics assembly, packaging.  
We mainly present solutions optimal for low-mid volume, research and development purposes.

These webinars contain live machine demonstrations and presentations broadcasted by the manufacturer, giving you the opportunity to ask questions directly to manufacturer representative or engineer.
 
You will discover our latest generation of equipment for dicing, dispensing, die bonding and wire bonding. 
 

WEBINAR #1 :  ADT – ADVANCED DICING TECHNOLOGIES

When:              Monday May 30th, 10:00h – 11:00h
Presentation:  ADT Dicing Saws /  ADT Dicing Blades

Agenda:     
1. Company and dicing equipment introduction – Dicing Saws, Peripheral equipment, Wettable QFN, new options!
2. ADT Dicing Blades Consumables introduction – Annular blades : Resin, Nickel, Sintered, Hub Blades, Dicing  processes, applications.
3. Q&A 


WEBINAR #2 :  ROYCE – BOND TESTING & DIE SORTING

When:                   Monday May 30th, 13:00h – 13:45h
Machine Demo:   ROYCE Bond 620 Multitester

Agenda:   
1. Company and bond testers introduction – Bond testers which can be used to pull test, bond shear and die shear. With industry leading accuracy and very user friendly S/W.
2. Die Sorters introduction – Die Sorters range from semi-auto table top systems to automatic            high speed 300mm systems with wafer map and ink-dot die selection and new automatic inspection.
3. Q&A 


WEBINAR #3 :  TPT WIREBONDER  –  MANUAL & SEMI-AUTOMATIC WIRE BONDERS

When:                   Tuesday May 31st, 10:00h – 11:00h
Machine Demo:   TPT HB100 Automatic Wedge, Ball and Bump Wire Bonder

Agenda:   
 1. Company and wire bonding systems introduction – TPT Wire bonding systems and options overview. 
2. Live Machine Demo TPT HB100 Auto Ball & Wedge – Basic machine and Bump bonding demonstration.                 
3. Q&A 


WEBINAR #4 : HESSE MECHATRONICS –  AUTOMATIC WIRE BONDERS

When:                  Tuesday May 31st, 13:30h – 14:30h
Machine Demo:   Hesse BJ653 Universal Wire Bonder. (Ball Bond Head)

Agenda:     
1.Company and wire bonding systems introduction – Hesse Wire bonding systems overview.
2. Live Machine Demo – BJ653 :Fine Wire Bonder – Basic machine and software demonstration, E-Box Camera system, PIQC.
3. Q&A 


WEBINAR # 5 :  TRESKY AG – MANUAL & SEMI-AUTOMATIC DIE BONDERS

When:                   Wednesday June 1st, 10:00h – 11:00h
Machine Demo:   New models  T4909-AE / T-5100 / T-5300

Agenda:     
1. Company and die bonding systems introduction – NEW 2022 Machine models, improvements & advantages possible hardware options / applications available.
2. Live Machine Demo – Basic Machines overview, Flip-Chip Optics. Pick and place, dispensing.              3. Q&A 


WEBINAR # 6 :  TRESKY AUTOMATION – AUTOMATIC DIE BONDERS

When:                  Wednesday June 1st, 13:30h – 14:30h
Machine Demo:  Tresky Automation T-6000-G Automatic Die bonder

Agenda:     
1.Company and die bonding systems introduction – Machine models and possible hardware options available.  Software HMI, Manual mode & Full Automation.
2. Live Machine Demo – Basic Machine demonstration shows ease of use both manual and automatic mode.
3. Q&A 


FOR FREE REGISTRATION PLEASE CLICK HERE TO SUBSCRIBE!

We hope to welcome you on our Accelonix Virtual Microelectronics Technology webinars!

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