May 30th to June 1st, 2022
We mainly present solutions optimal for low-mid volume, research and development purposes.
These webinars contain live machine demonstrations and presentations broadcasted by the manufacturer, giving you the opportunity to ask questions directly to manufacturer representative or engineer.
WEBINAR #1 : ADT – ADVANCED DICING TECHNOLOGIES
When: Monday May 30th, 10:00h – 11:00h
Presentation: ADT Dicing Saws / ADT Dicing Blades
1. Company and dicing equipment introduction – Dicing Saws, Peripheral equipment, Wettable QFN, new options!
2. ADT Dicing Blades Consumables introduction – Annular blades : Resin, Nickel, Sintered, Hub Blades, Dicing processes, applications.
WEBINAR #2 : ROYCE – BOND TESTING & DIE SORTING
1. Company and bond testers introduction – Bond testers which can be used to pull test, bond shear and die shear. With industry leading accuracy and very user friendly S/W.
2. Die Sorters introduction – Die Sorters range from semi-auto table top systems to automatic high speed 300mm systems with wafer map and ink-dot die selection and new automatic inspection.
WEBINAR #3 : TPT WIREBONDER – MANUAL & SEMI-AUTOMATIC WIRE BONDERS
When: Tuesday May 31st, 10:00h – 11:00h
Machine Demo: TPT HB100 Automatic Wedge, Ball and Bump Wire Bonder
1. Company and wire bonding systems introduction – TPT Wire bonding systems and options overview.
2. Live Machine Demo TPT HB100 Auto Ball & Wedge – Basic machine and Bump bonding demonstration.
WEBINAR #4 : HESSE MECHATRONICS – AUTOMATIC WIRE BONDERS
When: Tuesday May 31st, 13:30h – 14:30h
Machine Demo: Hesse BJ653 Universal Wire Bonder. (Ball Bond Head)
1.Company and wire bonding systems introduction – Hesse Wire bonding systems overview.
2. Live Machine Demo – BJ653 :Fine Wire Bonder – Basic machine and software demonstration, E-Box Camera system, PIQC.
WEBINAR # 5 : TRESKY AG – MANUAL & SEMI-AUTOMATIC DIE BONDERS
When: Wednesday June 1st, 10:00h – 11:00h
Machine Demo: New models T4909-AE / T-5100 / T-5300
1. Company and die bonding systems introduction – NEW 2022 Machine models, improvements & advantages possible hardware options / applications available.
2. Live Machine Demo – Basic Machines overview, Flip-Chip Optics. Pick and place, dispensing. 3. Q&A
WEBINAR # 6 : TRESKY AUTOMATION – AUTOMATIC DIE BONDERS
When: Wednesday June 1st, 13:30h – 14:30h
Machine Demo: Tresky Automation T-6000-G Automatic Die bonder
1.Company and die bonding systems introduction – Machine models and possible hardware options available. Software HMI, Manual mode & Full Automation.
2. Live Machine Demo – Basic Machine demonstration shows ease of use both manual and automatic mode.