Wednesday March 11, 2026 – Eindhoven
Explore the depths of innovative packaging technologyduring our exclusive free to attend Tech Day.
Meet the experts, attend insightful talks, and see live demonstrations of cutting-edge equipment in action.
📍 Accelonix Eindhoven – March 11, 2026
🕘 09:15h to 15:30h
Connect with our partners and other industry specialists, follow insightful presentations and assist in live demonstrations of equipment.
- Musashi Engineering : Image Master 350 PC, Super Sigma CMIV & Super Jet – Dispensing
- Dr. Tresky AG: T-5300 – Semi-Automatic Sub Micron Die Bonder – Die Bonding
- TPT Wire Bonder: TPT HB100 Full Automatic & TPT HB16 Semi-Automatic – Wire Bonding
- Musashi SM200 & ML-6000X Dispenser, Hesse Mechatronics BJ653 Automatic Wire Bonder, Royce 620 Bondtester, YXLON Cheetah X-Ray & CT Inspection , Takaya APT-1400F Flying Probe.
Whether you work in R&D, Production, Quality or just have general interest, this event provides a clear view of the challenges, opportunities and solutions in the field of microelectronics packaging.
👉 FREE PARTICIPATION – PLACES ARE LIMITED 👈
Confirm your attendance here! or send a message at sales@accelonix.nl
📩 Download the agenda
Guest speakers :
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| Okuyama Kaoru Managing director at Musashi Engineering Europe Extensive experience within the micro-dispensing industry, Mr Okuyama leads Musashi Engineering Europe in delivering high-precision, micro dosage dispensing solutions across a wide range of industrial applications. |
| Alex Tresky Director at Dr.Tresky AG Drawing on strong industry expertise, Mr. Tresky delivers innovative manual and semi-automatic die-bonding machines for high-precision microelectronics and semiconductor applications |
| Omer Akturk Sales Manager at Tresky Automation GmbH Mr Akturk drives sales of innovative automatic die-bonding machines at Tresky GmbH for high-precision microelectronics, photonics and industrial applications. |
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Stefan Kaltenbach Jochen Schuermans
Director at Roartis bvba Over 20 years of experience as a chemical engineer by training, Mr. Schuermans is founder and managing director of Roartis bvba, an internationally active producer of adhesives for industrial, electronics, and photonics assembly applications. |
Guest application engineers :
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| Stefan Bichlmeier Application Engineer Musashi Engineering Customer-focused Application Engineer with proven experience in Musashi micro-dispensing technology, translating application requirements into stable and repeatable dispensing solutions. |
| Carlo Carobbio Application Specialist TPT Wire Bonder Application Specialist for TPT wire bonders, providing process expertise, application support, and customer-specific bonding solutions for high-reliability manufacturing. |
👉 FREE PARTICIPATION – PLACES ARE LIMITED 👈
Confirm your attendance here! or send a message at sales@accelonix.nl
📩 Download the agenda
