WOTS 2022 Utrecht: Die Bonding Demonstrations

Discover the Tresky T-5100 – PC controlled manual die bonder – during WOTS 2022 at the Accelonix booth – 9C014.
Epoxy, eutectic-solder, flip chip, sinter: one system to support all die attach processes!

The T-5100 is a universal manual die bonder suitable for a wide range of micro-assembly tasks. The equipment features a superior ergonomic design, high-accuracy, a large 220 x 220mm assembly area with 125 mm of vertical travel and an integrated time/pressure dispenser, making it ideal for R&D through low volume production or custom assembly.

Dr Tresky – T-5100

Manual Die Bonder with pickup from up to 200mm wafer
Pick & place die from waffle pack, gel pack and tape etc.
Sub-micron placement capability
For epoxy, eutectic-solder, flip chip & sinter die attach processes etc.
Precision die to die and die on die placement capability
Integrated time pressure dispenser, optional stamping unit
Simple to use with excellent ergonomics & high build quality
Modular system covers virtually all die pick-place applications
True Vertical Technology™, guarantees parallelism during bonding

The machines rigid base is compact, fits on a lab desk and can be expanded with many different options, including eutectic scrub, gas heating, preform handling, tool heating, ultrasonic bonding, die flip and dynamic heated tooling etc., ensuring the system can be configured to suit even the most demanding manual die bonding requirements.

For more information, datasheets and video about the Tresky T-5100 and other Tresky Die Bonders please click here.

PS: On our booth you will also find solutions for X-Ray inspection, EMC and RF testing, wire bonding and software solutions for electronics (DFT, test coverage, NPI, Traceability and repair).