Micro assembly
Bond Testing: Pull Test, Shear Test and more…
Bond testing is necessary to evaluate the wire bonding quality and to confirm the consistency and reliability of the bonds in microelectronic assemblies and packages. The test evaluates the integrity … Read more
TRESKY AG, pick-and-place systems for micro assembly
TRESKY appointed Accelonix as distributor for their pick-and-place Systems for the Benelux, covering the Netherlands, Belgium and Luxembourg. We can now offer a series of powerfull bench top Die Bonders, ideal … Read more
