Bond Testing Services

From our demo lab in Eindhoven (NL) our experienced Application Engineers are able to offer Microelectronics Packaging and Bondtest Services.

Technical advise, flexibility, quality, fast delivery and a good and long term relation with our clients are the keywords for a succesfull coorperation.

  • Product and process demonstrations
  • Single prototype production
  • Low volume production
  • Process development and trainings

With our network of equipment manufacturers and local partners we are able to offer a solution for many Micro Electronics Packaging challenges.

Quick Enquiry

If you want to know more about Bond Testing Services

BOND TESTING SERVICES

Pulltest

  • For Fine Wire Application up to 100 gF
  • For Ball and Wedge wire Bonds
  • Destructive and non-destructive
  • Force profile data saved per test
  • Results are presented in measurement report.


Ballshear (Sheartest)

  • Up to 250 gF
  • For sheartest of fine wire ball bondings.
  • Sheartest of Gold Bumps
  • Destructive and non-destructive
  • Force profile data saved per test
  • Results are presented in measurement report.

Die shear / Heavy Wire Wedge Shear

  • Up to 5 kgF
  • For sheartest of small dies and components
  • Sheartest of heavy wire bond foots
  • Destructive and non-destructive
  • Force profile data saved per test
  • Results are presented in measurement report.

International standard compliance

  • MIL-STD-883
  • MIL-STD-750
  • ASTM F1269
  • JESD22-B117
  • JESD22-B116
  • CE

Accelonix Micro Electronics Packaging Services Brochure

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