BasicLine 3D

3D AOI Standalone

Stand-alone AOI System for manual Loading and flexible Adaptation of different Assemblies. Combines 3D SPI and 3D AOI functions.

The Goepel BasicLine can also be utilized as a separate repair station and is characterized by a comfortable fault classification via keyboard.

A multitude of variants and settings in illumination and camera make the system a highly precise and fast inspection device. Customized configurations and technical upgrades are also possible.

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3D AOI Standalone

Stand-alone AOI System for manual Loading and flexible Adaptation of different Assemblies.
The BasicLine can be utilized as a production AOI system or as separate repair station and is characterized by a comfortable fault classification via keyboard.

A multitude of variants and settings in illumination and camera make the system a highly precise and fast inspection device. Customized configurations and technical upgrades are also possible.

Stand-alone AOI System for manual Loading and flexible Adaptation of different Assemblies.

  • Pixel adapted camera module for all system variants
  • Telecentric lens for parallax-free image capturing
  • Multi-directional image capturing by means of 360° angled-view module rotation

The AOI system features Goepel MagicClick for fast automated programming and integrates to Goepel PILOT CONNECT for integration with MES and database systems to centralize all inspection and machine data..

  • Illumination from Infrared to Ultraviolet for high visibility also of low-contrast components, polarity marks, differences in material and pollutions.
  • Angled View Inspection over 360°.
  • Stable Inspection with optimised false call and pseudo error rate.
  • PILOT AOI software with powerful functions for component recognition, solder joint and short inspection, OCR, colour verification as well as solder paste inspectio
  • Inspections:
    Dimensions, Missing Components, Misalignment (X/Y Rotation), Wrong Body, Tombstone, Coplanarity, Text (OCR), Solder Joint, Lifted Lead, Missing Lead, Lead Offset, Bridges, Color Inspection, THT Pin Position, THT Pin Length, etc.
  • 3D-measurement measurement module 3D · EyeZ
    X/Y resolution (2D): 21 μm
    X/Y resolution (3D): 21 μm
    Z resolution (3D): 1 μm
  • 2D orthogonal camera with pixel adapted and telecentric optics
  • 2D/360° angled-view inspection for 360° inspection
  • Smallest testable component size: 01005, 0.3 pitch
  • Illumination: multi-spectral, multi-directional
  • Handling time: minimised by quick-clamping
  • Inspection speed: up to 60 cm²/s
  • PCB size: up to 510 mm x 500 mm
  • Max. PCB weight: 5 kg
  • PCB clearance top side: up to 65 mm
  • PCB clearance bottom side: up to 65 mm

MagicClick Saves up to 80% of AOI programming and optimization time.

  • Generates production-ready test program including component library in only a few minutes
  • PCB-specific layout is considered through import and automatic analysis of Gerber data
  • Optimization of inspection parameters based on sample PCB and IPC standard
  • Only minimal adjustments are required after test program generation
  • Efficient use of AOI already for second PCB
  • Up to 80% time savings for test program generation and optimization
  • Guarantees return on investment in the shortest time
  • Available in software PILOT AOI Version 6

Goepel BasicLine Datasheet 
Goepel Pilot AOI Datasheet 
Goepel Inspection Systems Brochure  


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