The T-8000-G Die Bonder is a fully-automated all-purpose system built on a granite mainframe.
Developed for a higher throughput and more accuracy, best fit for medium sized production.
This platform offers a large working area especially for 12“ wafer handling.
Open, with a wide range of applications and numerous available options, the T-8000-G can be customized to best suit all market needs.
T-8000-G : Flexible Automatic Die Bonder
The T-8000-L Die Bonder is a fully-automated all-purpose system built on a granite mainframe. Developed for a higher throughput and more accuracy, best fit for medium sized production.
This platform offers a large working area especially for 12“ wafer handling. Open, with a wide range of applications and numerous available options, the T-8000-G can be customized to best suit all market needs.
Direct link to Applications (Chapters) shown in this video:
00:00 Start
00:17 Conveyer / Indexer
01:06 Dispensing
01:27 Stamping
02:01 Chip to 12” Wafer
02:38 Fine Pitch Stamping
06:24 Automatic Tool Change
06:31 Pick & Place
06:53 Eutectic Scrubbing
07:01 Eutectic
08:13 Die Stacking
09:21 Ultrasonic Bonding
09:54 Bonding TO CAN
13:35 Glas Frit Bonding
15:10 UV Indexer
15:26 Customized Applications
Tresky Automation : T-8000-L Datasheet 
Tresky Automation : T-Series Overview Datasheet
