Die attach – Chip bonding Adhesives

Accelonix / ROARTIS® offers both isotropically conductive adhesives (conducting in 3 dimensions), as well as aniso-tropically conductive adhesives (conducting only in the z-direction).

Within our family of electrically conductive adhesi-ves, we provide materials optimized for dispensing, stencil- or screen printing, as well as stamping and jetting processes. Typical applications include bonding micro-electronic components onto temperature sensitive substrates, such as flexible circuits, or replacing solder pastes in applications where increased flexibility is required, especially for severe thermal-cycling requirements.

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ELECTRICALLY CONDUCTIVE

Electrically conductive Cure Viscosity (mPa.s) Resistivity (Ohm.cm) Worklife Remarks Datasheet
IQ-BOND 5401-CE 5 min @ 150°C 150.000 1×10-3 48 hrs Stencil Printing
15 min @ 120°C
IQ-BOND 5402-CE 5 min @ 150°C 78.000 5×10-4 24 hrs Dispensing/Jetting
15 min @ 120°C
IIQ-BOND 5404-CE 60 min @ 150°C 35000 5×10-4 48 hrs Fine Dot Dispensing / Jetting
120 min @ 120°C
IQ-BOND 5404-HV-CE 60 min @ 150°C 140000 5×10-4 24 hrs Higher viscous version of 5404-CE
120 min @ 120°C
IQ-BOND 5481-CE 2 hrs @ 90°C+ 15000 < 5×10-4 24 hrs For high temperature applicati-ons, Tg: 230°C,  Multiple stage cure.
3 hrs@150°C
IQ-BOND 5490-CE Multiple stage cure: 9000 5×10-2 12 hrs 300°C temperature resistance, Tg: 250°C
1hr @150°C+
1hr @ 180°C
IQ-BOND 5132-CE 15 min @ 175°C 15000 <5×10-4 12 hrs Flexibilized, for bonding surfaces with mismatched CTE’S
90 min @ 120°C

 

Insulating Cure Viscosity (mPa.s) Color Worklife Remarks Datasheet
IQ-BOND 2487 Multiple stage cure: 18000 Milky 24 hrs Low temperature cure, medium thyxo, good shear strength
2hrs@ 90°C+
3 hrs@150°C
IQ-BOND 2700 5 min @ 120°C 10000 Milky/clear 5 days Dip coating for hybrid circuits
10 sec @ 170°C
IQ-BOND 2705 1 min @ 150°C 35000 Beige 2 days UL94-VO certified potting resin
5 sec @ 170°C
IQ-BOND 2722 60 min @ 80°C 100000 Bright Yellow 5 days 1:1 mix ratio
IQ-BOND 2432-T 15 min @ 175°C 50000 Milky/ Off-white 12 hrs Flexibilized, Thermally Conductive, For CTE mismatch
60 min @ 150°C
90 min @ 120°C

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