Micro Electronics Workshop 21th April 2020 in Eindhoven
Date: 21th april 2020
Time : 09:15u – 15:30u
Location: Accelonix Eindhoven
Keep up to date with the latest solutions in the field of micro electronics assembly, packaging and inspection.
We mainly present tabletop solutions optimal for low volume, research and development purposes.
During this workshop you will discover our latest generation of equipment for dispensing, die bonding, wire bonding, bond testing.
At this event you will be able to meet representatives of our partners GPD, TRESKY and Hesse Mechatronics
Following assembly & test systems will be actively demonstrated and available for hands-on operation:
- GPD Volumetric Dispenser
- TRESKY T4909 Die Bonding & Flipchip
- Hesse BJ653, Auto Wedge, Ball & Heavy Wire Bonder
- Royce 650 Pull and shear bondtesting
In our showroom also the below equipments are presented:
- TPT HB16 Semi-Automatic Wedge, Ball wire Bonder.
- Yxlon Cheetah X-ray & CT inspection system
Do not hesitate to bring your application samples!
The workshop will start at 09:15 and will end at 15:30 at latest. Free lunch and refreshments are included.
We hope to welcome you at our workshop.
