Discover the TPT HB16 – Semi Automatic fine wire bonder at the Accelonix booth – 7B105 during Electronics & Applications 2023. The HB16 Semi-Automatic series bench top size wire bonder … Read more
Bond testing is necessary to evaluate the wire bonding quality and to confirm the consistency and reliability of the bonds in microelectronic assemblies and packages. The test evaluates the integrity … Read more
To address their future demanding wire bond applications, the MICROSYS lab of the University of Liège recently invested in a new Hesse BJ653 automatic wire bonder. This versatile, modular machine … Read more