For specialistic prototypes to low/mid volume production.
Automatic accurate epoxy bonding : GaAs, Silicon, Glass Dies
- Pickup from wafer, waffle of Gel Pak
- Component size from 0,2 mm to > 50mm
- Programmable Pattern Dispensing
- Handles CCD and other sensors, LCD’s MEMS.
- Unique Die Stacking with Bond line Thickness.
Applications :
- Chip on Board (COB)
- Chip on Flex (COF)
- Chip on Glass (COG)
- Chip in Package (Ceramic, Metal and Plastic)
- Many more…..
For specialistic prototypes to low volume production
Wedge-Wedge Bonding
- Alumium wires
- Gold wires
Ball – Wedge Bonding
- Gold wires
Gold Bump Bonding
- Flip Chip technology
Other:
- Ribbon bonding
- Microwave en RF technology
- Gold ribbon
For specialistic prototypes to low volume production
- Heavy wire: 100µm – 500µm
- Ribbon bonding
- Tab Bonding
- Insulated wire
High power Applications:
- Batterypacks, (fused wires)
- LED’s
- Automotive
- Many Power Electronics
- Many more…….
Accelonix has experience in the wire bonding and handling of Lithium-Ion cells used widely in Batterypacks for EHV!