DIE (EPOXY) BONDING SERVICES
For specialistic prototypes to low/mid volume production.
Automatic accurate epoxy bonding : GaAs, Silicon, Glass Dies
- Pickup from wafer, waffle of Gel Pak
- Component size from 0,2 mm to > 50mm
- Programmable Pattern Dispensing
- Handles CCD and other sensors, LCD’s MEMS.
- Unique Die Stacking with Bond line Thickness.
Applications :
- Chip on Board (COB)
- Chip on Flex (COF)
- Chip on Glass (COG)
- Chip in Package (Ceramic, Metal and Plastic)
- Many more…..
