Benefits of the TAKAYA APT-1600FD Flying Probe tester
Takaya flying probe testers can immediately adapt to specification changes, enabling high-quality production even from the prototype level.
The TAKAYA APT-1600FD uses up to ten flying probes to inspect the PCBA’s simultaneously from the top and bottom.
The mechanics and the measuring electronics are shared with the TAKAYA APT-1400F system.
The high precision, contact quality of the probes and the outstanding reliability are indentical and unique.
It is the preferred choice of testing for many EMS companies.
Goepel Takaya Boundary Scan Integration 
Connection to external equipment via multi-probe on a dedicated jig
This is an option to install a dedicated jig lifting mechanism on the bottom side of the APT-1600FD series.
It allows special test that connect to external equipment such as BST (JTAG boundary scan test), and the In System Programing/log reading of FPGAs and other ICs to be performed in parallel with in-circuit test.
TestWay Express is a fully integrated solution that enables electronic manufacturers to optimize the design to delivery flow by:
- Defining the manufacturing line; including a combination of assembly, inspection and test machines.
- Placing test probes intelligently to maximize the coverage and minimize the fixture costs, both initially and in the event of required modifications.
- Estimating the test coverage for each individual strategy using theoretical models and optimize the combined results.
- Generating input files for each test stage that reflects the test options for the selected strategy.
- Measuring the real test coverage by importing the post-debug test program or coverage data.
- Comparing the early estimation with the actual measured test program coverage, identifying gaps in the overall strategy.
The capability to generate lean test programs has particular benefits for the Takaya flying probe tester by:
- Reducing debug time: Machine capability models, automatic test creation algorithms, optimum probe angle selection methods and advanced circuit analysis work together to reduce the amount of machine debug time required after output, thereby increasing machine capacity.
- Increasing Test coverage: Push through technology allows automatic simple cluster testing to increase test coverage through low value resistive components.
- Reducing engineering effort: Automatic component modelisation and intelligent opportunity assessment work together to save engineering time.
- Increasing machine speed: Advanced circuit analysis algorithms allow the creation of tests to target the failure opportunities with no superfluous tests.
- Reducing machine workload: Powerful test coverage analyzers work within the machine capability models to allow the optimization of combined tests across multiple machines, in order to achieve a lean test strategy.
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