The Takaya APT-1400F is a next-generation flying probe test system which has unprecedented performance in terms of test speed, positioning accuracy and test coverage. Removing the requirement for a conventional bed-of-nails fixture and providing a wide variety of test facility will contribute largely to your R&D department and NPI section that ought to validate low-volume productions.
The TAKAYA APT-1400F is the fastest flying probe test system in the world and sets new standards in speed and test coverage for the competition.
The system has been specially developed for the test of complex circuit boards and large quantities. The APT-1400F has 6 flying probes, of which 2 are vertical probes that enable accesses to contact points that could not previously be reached.
The APT-1400F does not make any compromises between speed, reliability and long service life. The design of the XY table has been completely revised and optimally adapted to the high travel speed of the test probes and to the new mechanical design of the axes. An outstanding measurement unit and numerous innovative test algorithms enable significant increase of the test coverage on your circuit boards.
Breakthrough 4-heads & 6 flying probes system
High power motors and new high speed controllers
50% faster than conventional Flying Probe Tester
25% more accurate, smallest pad size < 60µm
New design of the XY axis and the XY table made of granite
Flexible “Composite Robot” longlife measurement and control cable
Advanced soft touch control
Measuring circuits mounted on the flying heads
Newly developed flexible board clamping mechanism
Conveyer system with an automatic width adjustment and SMEMA interface
In-Line Application: All APT systems are of course also available as In-Line variant. Equipped with a transport system with automatic width adjustment, the flying probe testers can be used for completely automated operation in a production line or in magazine to magazine operation.
16 Bit DAC/ADC measuring unit incl. 3 x DC 4-Quadrant sources and measurement system
R, L, C measurements
Measuring voltage < 0,1V
Kelvin measurements
Guard functions
Diodes & Zener diodes measurement functions
Voltage Controller/Operational Amplifier
Transistors/FET/Optocoupler/Relays/etc.
DC/AC Current- and Voltage Measurements
Dynamic curve measurements of components and circuits
Isolation Tests
Continuity test
Frequency measurements
AC signal generator
Cluster tests
IC Open sensor
LED Sensor (wave length and brightness)
Integration of external power supplies and test equipment(Boundary Scan, In System Programming, etc.)
High Density CCD color camera
2 x programmable LED ring illumination
Fiducial mark recognition (off set, rotation, shrinking)
Component recognition (polarity, presence, shift or wrong component)
1D and 2 D barcode recognition
Optical character recognition (OCR)
Color distinction for components
Color Real Map function for the graphical display of the board and the test points
Goepel Takaya Boundary Scan Integration
TestWay Express is a fully integrated solution that enables electronic manufacturers to optimize the design to delivery flow by:
Defining the manufacturing line; including a combination of assembly, inspection and test machines.
Placing test probes intelligently to maximize the coverage and minimize the fixture costs, both initially and in the event of required modifications.
Estimating the test coverage for each individual strategy using theoretical models and optimize the combined results.
Generating input files for each test stage that reflects the test options for the selected strategy.
Measuring the real test coverage by importing the post-debug test program or coverage data.
Comparing the early estimation with the actual measured test program coverage, identifying gaps in the overall strategy.
The capability to generate lean test programs has particular benefits for the Takaya flying probe tester by:
Reducing debug time: Machine capability models, automatic test creation algorithms, optimum probe angle selection methods and advanced circuit analysis work together to reduce the amount of machine debug time required after output, thereby increasing machine capacity.
Increasing Test coverage: Push through technology allows automatic simple cluster testing to increase test coverage through low value resistive components.
Reducing engineering effort: Automatic component modelisation and intelligent opportunity assessment work together to save engineering time.
Increasing machine speed: Advanced circuit analysis algorithms allow the creation of tests to target the failure opportunities with no superfluous tests.
Reducing machine workload: Powerful test coverage analyzers work within the machine capability models to allow the optimization of combined tests across multiple machines, in order to achieve a lean test strategy.
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