Tools

A wide range of tools to support your wire bonding process.

Description

H65 Unplugging Probe

H66 Tungsten Wire

H67 TPT Tweezers

H73 Torque Wrench

H68 TPT Bondsample

Recommend

Video and Microscopes

Video and Microscopes

Video and Microscopes for the TPT Wire Bonders

Add-on kits

Add-on kits

A wide range of add-ons for the TPT Wire Bonders.

TPT HB100

TPT HB100

The HB100 represents a new generation of automatic desktop wire bonder with motorised Z-X-Y axis and bondhead rotation.

Perfectly suited for laboratories and small volume productions.
This versatile machine can perform wedge and ball bonding with a single bond head.
With fast, precise linear motor axis, the HB100 is very easy to use and packed with exciting features such as a touch-screen, dual camera system and joystick control.
In addition, the latest software technology supports the user with process guidance and bond assist features.

Heater Stages

Heater Stages

A wide range of heater stages ensure an optimal fixation of your substrate or package during the wire bonding process.

TPT HB30

TPT HB30

The HB30 is a bench top size heavy wirebonder, easy to use and ideal for laboratories, pilot production runs and small scale production lines.

The HB30 benefits from a motorised Y and Z axis giving a greater control over the looping parameters, allowing the user to create consistent and repeatable wire bonds with ease.

TPT HB05

TPT HB05

The HB05 manual series bench top wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configurable with a single bondhead for ball and wedge bonding.

An intuitive user interface provides the user to access to all of the bond parameters and bonding recopies stored on the machine.

Tools

Description

Recommend

Video and Microscopes

Add-on kits

TPT HB100

Heater Stages

TPT HB30

TPT HB05

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