TRESKY T-7000 Photonics Bonder– High Precision Die Bonder for Nano & Opto Electronics
Key Features
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Modular design: Fully adaptable configuration for a wide range of applications.
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High accuracy: < 1 µm placement precision at 3 Sigma.
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Large working area: Ideal for multi-die and high-complexity assemblies.
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Up to 300 N bonding force: Optional higher forces available.
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Flexible integration: Compatible with a wide variety of feeders, bond heads, and automation options.
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User-friendly software interface: Powerful GUI for programming, recipe management, and traceability.
Specifications
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Bonding area: 500 x 700 mm with wafer table
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Z-axis travel: 100 mm
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Bond force range: 0.01 – 300 N (higher optional)
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Placement accuracy: < 1 µm @ 3σ
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Chip size range: < 0.05 mm up to large format
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Axes resolution: 0.001 µm (XYZ), 0.005° (theta)
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Tool rotation: 360°
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Max acceleration: 2.5 G
Supported Processes
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Flip-chip bonding
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Epoxy & eutectic bonding
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UV bonding
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Thermocompression bonding
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Photonics & glass bonding
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MEMS & SiP assembly
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Die sorting and multi-die placement
Optional Modules & Upgrades
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Advanced vision systems with WRGB ring light
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Heated tools & bonding stages (up to 450°C)
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Scrubbing and stamping units
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UV curing units
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Automatic tool changers
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Wafer handling & ejector stages
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Component feeders (waffle pack, tape, tray, etc.)
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ID scanning & traceability systems
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MES integration & wafer mapping
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Nitrogen or formic acid atmosphere for sensitive processes
Direct link to Applications (Chapters) shown in this video:
00:00 Start
00:17 Conveyer / Indexer
01:06 Dispensing
01:27 Stamping
02:01 Chip to 12” Wafer
02:38 Fine Pitch Stamping
06:24 Automatic Tool Change
06:31 Pick & Place
06:53 Eutectic Scrubbing
07:01 Eutectic
08:13 Die Stacking
09:21 Ultrasonic Bonding
09:54 Bonding TO CAN
13:35 Glas Frit Bonding
15:10 UV Indexer
15:26 Customized Applications
Tresky Automation : T-7000 Datasheet 
Tresky Automation : T-Series Overview Datasheet
