+31 40 7501650


PS200S Thermal Warpage and Strain Measurement Tool

Using the same Shadow Moiré technology as the AXP 2.0, the PS200S  is a laboratory based solution for products up to 150 mm x 200 mm. The PS200S uses the same software suite as the AXP 2.0, and will measure surface strain and coefficients of thermal expansion from room temperature upwards.

The TherMoiré® PS200S is a metrology solution that utilizes the Shadow Moiré measurement technique combined with automated phase-stepping to characterize out-of-plane displacement for samples up to 150 mm x 200 mm. With time-temperature profiling capability, the TherMoiré® PS200S captures a complete history of a sample’s behaviour during a user-defined thermal excursion.

The combination of the Shadow Moiré technique and dynamic temperature profiling is the foundation of the patented TherMoiré® platform. Dynamic profiling is the most effective approach to analyse mechanical behaviour induced by real-world processes and operating environments. Using the TherMoiré® PS200S, engineers will gain a better understanding of the interactions of materials, packages, substrates and complete assemblies, allowing for a thorough analysis of the system and improving its reliability and first pass yield performance. The PS200S is critical to helping meet the ever increasing interconnect and reliability requirements on both the device and substrate levels.

The PS200S is a laboratory solution designed for use in R&D, production and failure analysis/reliability applications, and accepts the Digital Image Correlation module for Strain and coefficient of thermal expansion assessment.

  • Failure/defect analysis
  • Quality assurance/quality control
  • High Volume Testing complimented by Part Tracking technology
  • Pass/Fail decisions versus industry standards, streamlined by Real Time Analysis software
  • Shape matching between attaching interfaces via Interface Analysis Software
  • Material and Design Choices
  • FEA Model Validation
  • Optional Digital Image Correlation (DIC) 2.0 Module
Digital Fringe Projection
Digital Image Correlation
Shadow Moiré

Akrometrix Studio is an advanced set of integrated software modules that work together to run all Akrometrix equipment. The Studio software suite takes users from profile creation, through warpage measurement, temperature profiling, analysis of warpage data, and reporting seamlessly. Studio software users will have nearly the same experience in working with different Akrometrix measurement technologies and different Akrometrix measurement tools.

The Studio Suite is broken up into a series of programs that work together

Profile Generator: (Create temperature profiles)
Surface Measurement: (Measurement Setup)
Thermal Profiler: (Measure warpage over temperature)
Surface Analysis: (In-depth data processing)
Interface Analysis: Understanding Warpage Between Two Mating Surfaces
Real Time Analysis for Pass/Warning/Fail Decisions
Part Tracking

Akrometrix General Brochure