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AXP 2.0

AXP 2.0 Thermal Warpage and Strain Measurement Tool

This modular metrology tool utilises Shadow Moiré measurement technology with automated phase stepping for out of plane displacement of samples to 400 mm square. Programmable time – temperature profiling allows the user to fully define the mechanical behaviour of products induced by real world processes and operating environments. It is ideal for failure and defect analysis as well as quality assurance and control. Optional modules provide for step height measurement, convection reflow emulation and strain and coefficient of thermal expansion assessment.



The TherMoiré® AXP is a modular metrology solution that utilizes the Shadow Moiré measurement technique, combined with automated phase-stepping, to characterize out-of-plane displacement for samples up to 400 mm x 400 mm. With time-temperature profiling capability, the TherMoiré® AXP captures a complete history of a sample’s behaviour during a user-defined thermal profile.

The combination of Shadow Moiré measurement and dynamic temperature profiling is the foundation of the patented TherMoiré® platform. Dynamic profiling is the most effective approach to analyse mechanical behaviour induced by real-world processes and operating environments. Using the TherMoiré® AXP, engineers can gain a better understanding of the interactions between materials, packages, substrates and complete assemblies.

The TherMoiré® AXP is an expandable modular metrology platform accepting Digital Image Correlation (DIC) 2.0 Module, Convection Reflow Emulation (CRE6) Module, Digital Fringe Projection (DFP) Module, Convective Module (CM) and the CoolBoost Module.

  • Powered by Akrometrix Studio Software
  • Up to 400 mm x 400 mm maximum sample size
  • Acquisition of 1.4 million displacement data points in less than 2 seconds
  • Enhanced temperature uniformity, convective heating and cooling with CRE6 Module
  • High resolution measurement of small form factor samples
  • XYZ axis strain and CTE calculation, via DIC
  • Increased lab productivity with advanced, powered cooling
  • Support for reliability testing from -50°C to 150°C+ and reflow simulation to 280°C+, via CM
  • Multiple part testing for increased throughput
Digital Fringe Projection
Digital Image Correlation
Shadow Moiré

Akrometrix Studio is an advanced set of integrated software modules that work together to run all Akrometrix equipment. The Studio software suite takes users from profile creation, through warpage measurement, temperature profiling, analysis of warpage data, and reporting seamlessly. Studio software users will have nearly the same experience in working with different Akrometrix measurement technologies and different Akrometrix measurement tools.

The Studio Suite is broken up into a series of programs that work together

Profile Generator: (Create temperature profiles)
Surface Measurement: (Measurement Setup)
Thermal Profiler: (Measure warpage over temperature)
Surface Analysis: (In-depth data processing)
Interface Analysis: Understanding Warpage Between Two Mating Surfaces
Real Time Analysis for Pass/Warning/Fail Decisions
Part Tracking

Akrometrix General Brochure