3D SPI - Solder Paste Inspection
Automated 3D SPI for early fault detection after solder desposition or stencil printing.
The SPI system monitors the printing process for correct position of the solder paste depot and for measuring the deposit volumes and volume distribution.
The use of a 3D SPI system strongly reduces the risk of soldering defects in the PCB assembly process.
Accelonix Services
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