Accelonix Newsletter – Q4 2020 Micro Electronics Solutions

Accelonix Newsletter – Q4 2020

Micro Electronics Solutions

With many years of experience, Accelonix are experts in the field of Microelectronics assembly, we offer a broad range of complementary products ranging from bare die handling through to plasma treatment, dispensing, die bonding, wire bonding, and more.

Just before this challenging year ends and on the doorstep of a hopefull 2021 we like to inform you on the latest news on our Microelectronics packaging solutions.

Here you will find our Newsletter – Q4 2020
We hope you enjoy reading and look forward to meet with you in 2021!

[AWL-BlogFilter blog_template=”template3″ blog_col_large_desktops=”col-lg-4″ blog_col_desktops=”col-md-4″ blog_col_tablets=”col-sm-6″ blog_col_phones=”col-xs-12″ blog_image=”yes” blog_image_link=”yes” blog_image_lightbox=”yes” blog_image_hover_effect=”hover2″ blog_image_quality=”medium” blog_title=”yes” blog_title_font_size=”15″ blog_title_color=”#000000″ blog_desc=”yes” blog_desc_characters=”100″ blog_desc_font_size=”13″ blog_desc_color=”#4c4c4c” blog_desc_box_color=”#ffffff” blog_read_more=”yes” blog_read_more_text=”Read More” blog_date=”yes” blog_author_below_image=”yes” blog_order_by=”date” blog_order=”DESC” blog_filter_order_by=”title” blog_filter_order=”ASC” blog_thumb_hover=”yes” blog_thumb_spac=”2″ blog_pagination=”no” blog_pagination_color=”#1e73be” blog_per_page=”30″ blog_filters=”no” blog_search=”no” blog_search_text=”Search” blog_filtering=”blog_category” blog_buttons_color=”#1e73be” selected_categories=”1328″ exclude_categories=”” default_cat_filter=”none” custom-css=” ” ]