Microelectronics Technology Webinars
April 20th to April 28th, 2021
Keep up to date with the latest solutions in the field of micro electronics assembly, packaging by participating our technology webinars.
We mainly present solutions optimal for low-mid volume, research and development purposes.
During this live video demonstrations / workshops presented by the manufacturer experts, you will discover our latest generation of equipment for dicing, dispensing, die bonding and wire bonding.
Following assembly systems are presented and demonstrated directly by the manufacturer representatives and engineers:
When:
Tuesday April 20th, 10:00h – 11:00h
Machine Demo :
ADT Dicing Saws and Dicing Blades
Agenda:
1. Company and dicing equipments introduction
Dicing Saw Overview, Submerge dicing, Medical System, Tilted Spindle, HMT feature, Scrap Removal GMF (Geometric Modul Finder), Wettable Process.
2. ADT Dicing Blades Consumabled introduction
Annular blades : Resin, Nickel, Sintered, Hub Blades, Dicing processes, applications.
3. Q&A
When:
Tuesday April 20th, 15:00h – 16:00h
Machine Demo:
GPD Catalina Benchtop DispenserAgenda:
Agenda:
1. Company and Dispense pumps and systems introduction
Dispensing Pumps and systems overview. Field of application.
2. Live Machine Demo
3. Technology topic:
Dispensing MEMS Blood Pressure Sensors using three different dispensing processes. SECS/GEM with panel mapping and other Industry 4.0 features.
4. Q&A
When:
Thursday April 22th, 10:00h – 11:00h
Machine Demo:
Tresky T-3002-PRO Semi-Automatic Die Bonder
Agenda:
1. Company and Die Bonding systems introduction
Machine models and possible hardware options available.
2. Live Machine Demo
Basic Machine demonstration, Flip-Chip Optics. Pick and place, Dispensing.
When:
Friday April 23th, 10:00h – 11:00h
Machine Demo:
Tresky Automation T-6000-L Automatic Die bonder
Agenda:
1. Company and Die Bonding systems introduction
Machine models and possible hardware options available.
Software HMI, Manual mode & Full Automation.
2. Live Machine Demo
Basic Machine demonstration shows ease of use both manual and automatic mode.
3. Q&A
When:
Monday April 26th, 13:00h – 13:45h
Machine Demo:
TPT HB16 Semi-Automatic Wedge, Ball and Bump Wire Bonder
Agenda:
1. Company and Wire Bonding systems introduction
TPT Wire bonding systems and options overview.
2. Live Machine Demo – TPT HB16 Semi-Auto Ball & Wedge
Basic Machine demonstration
3. Technology topic:
BBOS (Bond Ball on Stitch) and BSOB (Bond Stitch on Ball) when and how to use.
4. Q&A
When:
Wednesday April 28th, 10:00h – 11:00h
Machine Demo:
Hesse BJ653 Universal Wire Bonder. (Ball Bond Head)
Agenda:
1. Company and Wire Bonding systems introduction
Hesse Wire bonding systems overview.
2. Live Machine Demo – BJ653 :Fine Wire Ball Bonder
Basic machine and software demonstration
3. Topics:
Manual Bonding, E-Box, Production Screen, Pattern Recognition, Offline programming, and more
4. Q&A
FOR FREE REGISTRATION PLEASE CLICK HERE TO SUBSCRIBE!
All presentations, hand-outs and brochures will be available for download.
We hope to welcome you on our Accelonix Virtual Microelectronics Technology Days!
