FINE WIRE BONDING SERVICES
For specialistic prototypes to low volume production
Wedge-Wedge Bonding
- Alumium wires
- Gold wires
Ball – Wedge Bonding
- Gold wires
Gold Bump Bonding
- Flip Chip technology
Other:
- Ribbon bonding
- Microwave en RF technology
- Gold ribbon
HEAVY WIRE BONDING SERVICES
For specialistic prototypes to low volume production
- Heavy wire: 100µm – 500µm
- Ribbon bonding
- Tab Bonding
- Insulated wire
High power Applications:
- Batterypacks, (fused wires)
- LED’s
- Automotive
- Many Power Electronics
- Many more…….
Accelonix has experience in the wire bonding and handling of Lithium-Ion cells used widely in Batterypacks for EHV!