XLine 3D

Advanced inline 3D X-Ray Inspection for PCB Assembly

The X Line · 3D is an inline AXI system for high-end inspection in mass production of printed circuit boards. It is used for quality assurance in complex and high-quality assemblies at a high testing speed.

The three-dimensional X-ray inspection captures both the top and bottom sides of PCBs within a continuous process. By combining X-ray inspection (AXI) with an AOI module, inspection tasks can also be carried out which are not possible using X-ray alone (AXOI).

The system is available in various speed configurations and can be adapted to the customer-specific test strategies by means of two different image acquisition concepts.

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Advanced inline 3D X-Ray Inspection for PCB Assembly

The AXI systems from GÖPEL electronic are versatile. Standard tasks include the inspection of BGA, QFN, THT, LED and LGA solder joints. In addition, all other solder joints, whether visible or hidden, on a PCB can be inspected. Press-fit connectors are also inspected using the 3D planar CT process. During X-ray inspection, there are no AOI-typical reflections and shadows that could influence the inspection. The inspection is based on the absorption of the material which has different densities and thicknesses. The color and gloss level of a surface do not influence the X-ray inspection.

Some image examples:

BGA with Head-in-Pillow Effect
BGA with Voiding
CT View of THT solder barrel fill with voids
2D versus 3D X-Ray Image of an LGA Component