Discover the TPT HB16 – Semi Automatic fine wire bonder at the Accelonix booth – 7B105 during Electronics & Applications 2023. The HB16 Semi-Automatic series bench top size wire bonder … Read more
To address their future demanding wire bond applications, the MICROSYS lab of the University of Liège recently invested in a new Hesse BJ653 automatic wire bonder. This versatile, modular machine … Read more
A New Bonder for manual or automatic bonding The Bondjet BJ653, with its changeable bond heads, serves the wire bonding processes of wedge-wedge as well as ball-wedge and can handle … Read more
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