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Resin-bond Dicing Blades Datasheet 
Dicing Blades Resin-bond
- Resin as binder allows for blade wear management rendering Resin-bond Blades an excellent choice for hard and brittle materials such as: QFN/MLF, Thick Ceramic Substrates, HTCC and Glass
- Resin Blade thickness varies from 3 mil to 100 mil (depending on diamond grit size)
- Diamond grit size ranges from 3 microns to 250 microns (depending on blade thickness)
- Our new “D” series Resin Blade for QFN:
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