Stay up to date on the latest technologies for inspection in the PCB assembly.
Take advantage of our May 2021 webinars on Goepel electronics 3D AOI and AXI technology, covering the latest evolution on process inspection for solder paste printing, component placement and soldering.
AXI systems – From exotic to established standard
Date: Tue, May 4, 2021 11:00 AM – 12:00 PM CEST
Registration: Goepel registration page
Abstract: AXI systems were considered exotic in SMT production lines for a long time. Although it was known that X-ray inspection was the method of choice for solder joints on BGAs, QFNs, LEDs, LGAs and THT components, these were either not inspected at all or were inspected in random samples with manual X-ray systems (MXI). This has changed considerably in recent years. AXI systems have long since ceased to be exotic and have become an established standard, not only in automotive lines.
But what distinguishes a state-of-the-art AXI system? This webinar will provide the answers.
The X Line AXI system family will be used to demonstrate which X-ray imaging technologies are used to achieve maximum inspection coverage. In addition to possibilities for fast 3D X-ray imaging, inspection strategies for hidden solder joints will be discussed and the software package used will be presented. Current requirements for networking the AXI system in the world of Industry 4.0 are also discussed.
The participant receives information about strategies for automatic X-ray inspection of BGA, QFN, LED, LGA and THT solder joints.
Basic knowledge about 2D, 2.5D and 3D image acquisition will be shared.
3D AOI – 6 ways to increase efficiency with AOI
Date: Tue, May 11, 2021 11:00 AM – 12:00 PM CEST
Registration: Goepel registration page
Abstract: The webinar will focus on functions of AOI systems that, in addition to the inspection task, offer significant opportunities for increasing efficiency in manufacturing operations.
In the first part, the presentation will discuss how an intelligent combination of inspection program creation, optimization and defect classification at the verification station guarantees significant time savings in the everyday operation of an AOI system.
Subsequently, flexibility in the universal application of AOI is illustrated, e.g. doubling as an SPI system or applied to user-specific inspection tasks.
The third part covers the integration of different inspection systems into a data infrastructure, which enables a resource-saving, central and cross-line verification incl. failure evaluation.
