IQ-BOND 5402 CE is a solvent-free, one-component, pre-mixed, thermoset epoxy based adhesive. It offers the combination of short curing cycles, combined with good electrical conductivity.
The rheology of IQ-BOND 5402 CE is ideally suited for high speed small dot dispensing. Also stamping processes can be considered with IQ-BOND 5402 CE. IQ-BOND 5402 CE has a work life at room temperature, of about 24 hrs.
IQ-BOND 5402 CE bonds very well to metals, glass, ceramics, as well as plastics. It is used for applications where elevated soldering temperatures are not preferable, and low-temperature cure is required.
Typical applications include bonding micro-electronic components onto temperature sensitive substrates, such as flexible circuits. Also for those applications where solders are too rigid, the flexible nature of IQ-BOND 5402 CE makes it a suitable alternative for improved thermal cycling resistance.
| IQ-BOND 5402-CE | |
|---|---|
| Product group | Electrically conductive adhesive (Isotropic) |
| Strong points | Short curing cycles, good electrical conductivity, high speed small dot dispensing, lower viscosity version of IQ-BOND 5402-CE |
| One Komponent or two komponents | 1 K |
| Color | Silver |
| Viscosity | 78.000 mPa.s |
| Cure | 5 min @ 150°C / 15 min @ 120°C |
| Storage | 3 months @ -20°C; 6 months @ -40°C |
| Thyxotropie | Medium |
