Roartis IQ-Bond Adhesives

Roartis IQ-Bond Adhesives

Electrical Conductive Adhesives

Accelonix / ROARTIS® offers both isotropically conductive adhesives (conducting in 3 dimensions), as well as aniso-tropically conductive adhesives (conducting only in the z-direction).

Within our family of electrically conductive adhesi-ves, we provide materials optimized for dispensing, stencil- or screen printing, as well as stamping and jetting processes. Typical applications include bonding micro-electronic components onto temperature sensitive substrates, such as flexible circuits, or replacing solder pastes in applications where increased flexibility is required, especially for severe thermal-cycling requirements.

Quick Enquiry

If you want to know more about Electrical Conductive Adhesives

Please fill out this form.

Description

ISOTROPIC

1-Komponent	Cure	Viscosity (mPa.s)	Resistivity (Ohm.cm)	Worklife	Remarks	Datasheet
IQ-BOND 5401-CE	5 min @ 150°C	150.000	1×10-3	48 hrs	Stencil Printing
IQ-BOND 5401-CE	15 min @ 120°C	150.000	1×10-3	48 hrs	Stencil Printing
IQ-BOND 5402-CE	5 min @ 150°C	78.000	5×10-4	24 hrs	Dispensing/Jetting
IQ-BOND 5402-CE	15 min @ 120°C	78.000	5×10-4	24 hrs	Dispensing/Jetting
IQ-BOND 5424-CE	3 min @ 150°C	300.000	5×10-4	72 hrs	Stencil & Screen Printing
	15 min @ 120°C

IQ-BOND 5408-CE	5 min @ 150°C	150.000	5×10-3	24 hrs	Compatible with copper
IQ-BOND 5408-CE	15 min @ 120°C	150.000	5×10-3	24 hrs	Compatible with copper
IQ-BOND 5132-CE	15 min @ 175°C	160.000	5×10-4	12 hrs	Flexibilized, for CTE mismatch, high temperature resistance up to 200°C
IQ-BOND 5132-CE	90 min @ 120°C	160.000	5×10-4	12 hrs
IQ-BOND 5415-CE	15 min @ 130°C	55.000	5×10-4	3-5 days	Dispensing/Stencil & Screen Printing
	45 min @ 120°C
	16 hrs @ 90°C

2-Komponent	Cure	Liquid/ paste	Resistivity (Ohm.cm)	Worklife	Remarks	Datasheet
IQ-BOND 5600-CE	1 min@ @150°C	Paste	< 5×10-4	45 min	Standard version, low outgassing, very high adhesion strength, ESA-usage
	10 min @ 120°C
	3 hrs @ 50°C
	24 hrs @ 25°C
IQ-BOND 600-CE-SMP	1 min @ 150°C	Paste	< 5×10-4	45 min	Finer particle version of the IQ-BOND
	10 min @ 120°C				5600-CE, additional manufacturing steps guarantee smaller particles
	3 hrs @ 50°C
	24 hrs @ 25°C
IQ-BOND 5601-CE	1 min @ 150°C	Paste	< 5×10-4	4 hrs	Easy 1:1 Mix-ratio
	10 min @ 120°C
	3 hrs @ 50°C
	48 hrs @ 25°C
IQ-BOND 5611-CE	5 min @ 150°C		< 5×10-4	4 hrs	2:1 Mix-ratio, low temperature cure, lower viscosity
	30 min@ 120°C
	2 hrs @ 80°C
	48 hrs @ 25°C

ANISOTROPIC

1-Komponent	Cure	Viscosity (mPa.s)	Worklife	Remarks	Datasheet
IQ-BOND 5970-M-ACE	5 min@ 150°C	6.000	12 hrs	Very fast cure, high ionic purity
IQ-BOND 5970-M-ACE	15 min @ 120°C	6.000	12 hrs	Long potlife with reasonable fast cure
IQ-BOND 5971-ACE	5 min @ 150°C	5.200	48 hrs
IQ-BOND 5971-ACE	15 min@ @120°C	5.200	48 hrs
IQ-BOND 5972-ACE	3 min @ 150°C	13.000	5 days	Very long potlife
IQ-BOND 5972-ACE	15 min @ 120°C	13.000	5 days	Very long potlife
IQ-BOND 5973-ACE	5 min @ 150°C	3.500	5 days	Snap cure, long work life
IQ-BOND 5973-ACE	15 min @ 120°C	3.500	5 days	Snap cure, long work life, low cost al-
IQ-BOND 5976-ACE	15 min @ 175°C	35.000	5 days	ternative for high volume applications
IQ-BOND 5976-ACE	90 min @ 120°C	35.000	5 days	Combination of ultra-fast cure with
IQ-BOND 5977-ACE	1 sec @ 190°C	30.000	2 days	long worklife
	3 sec @ 170°C
	10-15 sec @ 150°C
	5 min @ 100°C