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LATEST NEWS
Test Convention connect 2021 – Register Now
With “Test Convention connect 2021”, our partner Goepel electronic is launching the digital version of this testing technology event for the first time. No...read more →
Advanced Dicing Technologies
Accelonix Benelux has a long history as distributor of ADT (Advanced Dicing Technologies) dicing solutions. ADT offers turnkey dicing solutions optimal for each application,...read more →
Bond Testing: Pull Test, Shear Test and more…
Bond testing is necessary to evaluate the wire bonding quality and to confirm the consistency and reliability of the bonds in microelectronic assemblies and...read more →
Die Sorting with Automatic Inspection
AP+ Automated Die Sorter: New Automatic Inspection Royce Instruments is excited to announce that they have successfully developed an automated inspection package for the...read more →
Microsys Lab Gears Up for Future Assembly Challenges with New Hesse BJ653 Wire Bonder
To address their future demanding wire bond applications, the MICROSYS lab of the University of Liège recently invested in a new Hesse BJ653 automatic...read more →
Flying Probe Tester with JTAG/Boundary Scan Integration – Takaya APT-1600FD with Multiprobe
The system integration of JTAG/Boundary Scan for the Takaya Flying Probe Systems has been extended. A specially designed hardware and software package from GOEPEL...read more →
A look behind the scenes…the 3D – Inline – AXI process for SMD and THT
“It’s all in the mix – inline X-ray systems must be flexible and adapt to all required inspection tasks”, says Andreas Türk, Product Manager...read more →
Electrical Disturbance Testing of Redundant Automotive Safety Systems – EMC Best Practice Webinar
If you are interested in the latest evolution in EMC testing for automotive applications, then register for the EMC Best Practice Webinar “Electrical Disturbance...read more →
