The Bondjet BJ830 is a fully automated, thermosonic fine wire ball-wedge bonder with a large working area. The BJ830 is designed for wire bonding challenges on a single platform. Typical applications are components in the HF and RF technology, COB, MCM and hybrids, opto and automotive electronics. The BJ830 defines the latest state of technological development compared to the competition and is benchmark for:
The largest working area of ball-wedge bonders
Precise positioning according to great axis accuracy
High precision touchdown detection without time delay, e.g. for bonding on very thin substrates
Precise bondforce control
Multi-level bonding according to Z axis stroke of 31 mm (1.22″)
E-Box: graphical ball inspection
Automated bondforce calibration
Rapid image capture with new digital image processing and flash light illumination
Flexibility
Working area : 305 mm x 410 mm (12″ x 16″)
Can serve two or more smaller bonding stations for efficient handling of smaller products or substrates, elimination indexing time and maximization of throughput (with indexers as well as manual loading)
Universal software interface for indexer control
Enables intelligent automation of extra large products
Quality
Continuous real time monitoring of wire deformation, transducer current, frequency and impedance within programmable control limits
BDE, traceability – integrated CSV-Logger or customized implementation
SECS/GEM – integrated standardized server connection for automation and communication
MES – Interface to Manufacturing Execution Systems, integrated or customized implementation
Working area
X: 305 mm (12″); Y: 410 mm (16″); Z: 31 mm (1.22″) P-Rotation: 180° in the ball-wedge mode
Mechatronic bondhead
BW01 Ball-Wedge Bondhead Frequency: 120 kHz or 60 kHz Option: Dual frequency 120/60 kHz
Wire
17.5 µm – 50 µm (0.7 mil – 2.0 mil)
Spool size (diameter): 50.8 mm (2″), double-flanged spool
NEFO spark generator
Max. sparking current: 100 mA (adjustable in time and level)
Programmable pre-sparking voltage: 2500 V-5000 V
Max. main sparking voltage: 1000 V
Detection of missing spark, short circuit and spark breakaway
Process advantages
Thermosonic ball-wedge bonding
Loop generator for customized loops
Various loop form functions
Constant wire length
Constant loop height
Individual loop shapes
Media connectivity
Gigabit-Ethernet (TCP/IP)
Compressed air (high-purity)
Vacuum
16A AC
Digitale IO´s
USB-Port
SMEMA
Machine dimensions
740 mm x 1484 mm x 1912 mm (29.1″ x 58.4″ x 75.3″) (W x D x H), height without status lamp
Weight
approx. 1100 kg
Ball-Wedge Bondhead
Typ: BW01 Ball-Wedge Bondhead
Frequency: 120 kHz or 60 kHz Option: Dual frequency 120/60 kHz
Wear-free and low maintenance components
Deep access capability: 12 mm (depending on capillary length)
Maintenance-free flexure hinges
Free programmable tail length, tear stroke and opening gap of wire clamp
Low maintenance costs
Precise bond force control, 10 cN – 300 cN programmable
E-Box
Adjustment tool for wire bonders
The E-Box of the Hesse GmbH is a patent-registered visualisation system for control supported, reproducible adjustments of bondhead elements or for graphical ball inspection. It includes a camera for optical displaying of wedge, cutter and wire guide as well as a graphical support for adjustment- and positioning control. E-Box allows significant time reduction for setting up the machine. Software enhanced optical adjustment system for wedge, cutter and wire guide / wire clamp.E-Box for Bonder – Advantages during Production
Better reproducibility of the adjustment depending attributes (e.g. loop forming) after change of wearing parts
Longer life time of wearing parts
Advantages for Bond Process
Graphical ball inspection in the ball-wedge mode
System for reproducible set-up of wedge, cutter and wire guide / wire clamp
Set-up without microscope
Free programmable, specified positions for bondhead elements
shown as limitation line
different views selectable (different sides, bottom, front etc.)
Minimizes time expenditure for set-up work, set-up control and readjustment
Automation
The precise and safe handling of the products in and out of the production machine plays a significant role in controlling the product quality, yield and efficiency of the production equipment. For this reason Hesse GmbH is offering automation concepts individually adapted for every application.
The portfolio of automation components for our machines consists of the following groups:
Indexer / Transport system
Bonding Station
Magazine Lifts
Visualization
MES Interface
All our machines are suitable for integration into production lines. This also applies to indexers and magazine lifts, which generally communicate to neighbouring systems by SMEMA interface. The customer specific special solutions which differ from the standard, have lead to some extraordinary optional features, such as:
Indexer with automatic rail width adjustment
Indexer with tilt function for bonding 3-dimensional MID’s
Integrated barcode scanner for automatic program selection
Indexer with 2 or 3 rails for parallel AUER boat processing
Manual heated workholder with adjustable height for maximum flexibility
Magazine lifts with capacity for multiple magazines
