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Bondjet BJ830

Fully Automatic Large Area Ball-Wedge Bonder

The Bondjet BJ830 is a fully automated, thermosonic fine wire ball-wedge bonder with a large working area. The BJ830 is designed for  wire bonding challenges on a single platform. Typical applications are components in the HF and RF technology, COB, MCM and hybrids, opto and automotive electronics. The BJ830 defines the latest state of technological development compared to the competition and is benchmark for:

  • The largest working area of ball-wedge bonders
  • Precise positioning according to great axis accuracy
  • High reliability and repeatability

Description

Advanced features and process advantages

  • High precision touchdown detection without time delay, e.g. for bonding on very thin substrates
  • Precise bondforce control
  • Multi-level bonding according to Z axis stroke of 31 mm (1.22″)
  • E-Box: graphical ball inspection
  • Automated bondforce calibration
  • Rapid image capture with new digital image processing and flash light illumination

Flexibility

  • Working area : 305 mm x 410 mm (12″ x 16″)
  • Can serve two or more smaller bonding stations for efficient handling of smaller products or substrates, elimination indexing time and maximization of throughput (with indexers as well as manual loading)
  • Universal software interface for indexer control
  • Enables intelligent automation of extra large products

Quality

  • Continuous real time monitoring of wire deformation, transducer current, frequency and impedance within programmable control limits
  • BDE, traceability – integrated CSV-Logger or customized implementation
  • SECS/GEM – integrated standardized server connection for automation and communication
  • MES – Interface to Manufacturing Execution Systems, integrated or customized implementation
Working area

  • X: 305 mm (12″); Y: 410 mm (16″); Z: 31 mm (1.22″) P-Rotation: 180° in the ball-wedge mode

Mechatronic bondhead

  • BW01 Ball-Wedge Bondhead Frequency: 120 kHz or 60 kHz Option: Dual frequency 120/60 kHz

Wire

  • 17.5 µm – 50 µm (0.7 mil – 2.0 mil)
  • Spool size (diameter): 50.8 mm (2″), double-flanged spool

NEFO spark generator

  • Max. sparking current: 100 mA (adjustable in time and level)
    • Programmable pre-sparking voltage: 2500 V-5000 V
    • Max. main sparking voltage: 1000 V
  • Detection of missing spark, short circuit and spark breakaway

Process advantages

  • Thermosonic ball-wedge bonding
  • Loop generator for customized loops
  • Various loop form functions
    • Constant wire length
    • Constant loop height
    • Individual loop shapes

Media connectivity

  • Gigabit-Ethernet (TCP/IP)
  • Compressed air (high-purity)
  • Vacuum
  • 16A AC
  • Digitale IO´s
  • USB-Port
  • SMEMA

Machine dimensions

  • 740 mm x 1484 mm x 1912 mm (29.1″ x 58.4″ x 75.3″) (W x D x H), height without status lamp

Weight

  • approx. 1100 kg
Ball-Wedge Bondhead
 
  • Typ: BW01 Ball-Wedge Bondhead
  • Frequency: 120 kHz or 60 kHz Option: Dual frequency 120/60 kHz
  • Wear-free and low maintenance components
  • Deep access capability: 12 mm (depending on capillary length)
  • Maintenance-free flexure hinges
  • Free programmable tail length, tear stroke and opening gap of wire clamp
  • Low maintenance costs
  • Precise bond force control, 10 cN – 300 cN programmable
E-Box
 
Automation

Bondjet BJ830 Datasheet

E-Box Datasheet