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Bondjet BJ820

High Speed Fully Automatic Fine Wire Wedge Bonder

The Bondjet BJ820 is the world´s leading fully automated fine wire wedge wedge bonder. The BJ820 is ready for all wire bonding challenges on a single platform, using wires and ribbons made of aluminium, copper and gold. Typical applications are components in the HF and RF technology, COB, MCM and hybrids, opto and automotive electronics. The BJ820 defines the latest state of technological development compared to the competition and is benchmark for:

  • The highest bonding speed in the industry
  • The largest working area of fast running fine wire bonders
  • The greatest axis accuracy

Description

Precision

  • High precision touchdown detection without time delay
  • Precise bondforce control (static and dynamic)

Flexibility

  • Largest working area: 305 mm x 410 mm (12″ x 16″)
  • Can serve two or more smaller bonding stations for efficient handling of smaller products or substrates,
  • elimination indexing time and maximization of throughput (with indexers as well as manual loading)
  • Universal software interface for indexer control
  • Enables intelligent automation of extra large products

Speed

  • Up to 7 wires per second, application-dependent,
  • e.g. with parameters25 µm wire, 1 mm loop length, metallized wafer, 127 ms per bond;
  • 2 mm loop length, 134 ms per bond

Quality

  • Continuous real time monitoring of wire deformation, transducer current, frequency and impedance within programmable control limits
  • Piezo bondhead with low maintenance
  • Easy connectivity to Hesse Mechatronics` workbench with modules such as process data and backup system PBS200, PiQC, processdatadrain, Secs/Gem or to standard/custom MES (Manufacturing execution systems)
  • Process integrated Quality Control (PiQC), detection of other parameters by additional sensors (e.g. friction) for 100% quality monitoring in real time (patented)
  • E-Box: patented solution for optimized tool change and programmable alignment marks for wedge and wire clamp

Process Advantages

  • Loop length: 70 µm up to 20 mm (2.8 mil – 800 mil), depending on wire diameter
  • Various loop form functionsConstant wire length
  • Constant loop height
  • Individual loop shapes
  • Fine Pitch 40 µm inline, 25 µm staggered/dual line (depending on wire and loop)

Working area

  • X: 305 mm (12“);  Y: 410 mm (16“);  Z: 30 mm; P: 420°

Mechatronic bondhead

  • BK04 Bondhead 45°, BK04 Bondhead 60
  • DA04 Bondhead 90° (Deep Access)

 
Speed

  • Up to 7 wires per second, application-dependent,
  • e.g. with parameters25 µm wire, 1 mm loop length, metallized wafer, 127 ms per bond;
  • 2 mm loop length, 134 ms per bond

Wire

  • Al, Au: 17.5 µm – 50 µm (0.7 mil – 2.0 mil) (optional heating stage)Optional (after consultation): 12.5 µm – 75 µm  (0.5 mil – 3.0 mil)
  • Cu: 17.5 µm – 30 µm (0.7 mil – 1.2 mil)Cu (in development): 50 µm (3 mil)

Ribbon (Deep Access bondhead)

  • Al, Au: 35 µm x 6 µm (1.4 mil x 0.25 mil) up to 250 µm x 25 µm (10 mil x 1 mil)

Machine dimensions

  • 722 mm x 1250 mm x 1800 mm (W x D x H), height without status lamp

Media connection

  • RJ45 (2 x)
  • Compressed (high-purity)
  • Vacuum
  • 16A AC
  • Digital IOs
  • USB-Port
  • SMEMA

Weight

  • approx. 1350 kg

Fine Wire Bondhead

  • Type: BK04 Bondhead 45°
    Option: BK04 Bondhead 60°
  • Frequency: 100 kHz (93.5 kHz); alternative frequencies can be realized by our own transducer construction
  • Wire: Al, Au: 17.5 µm – 50 µm (0.7 mil – 2.0 mil)
    Optional (after consultation): 12.5 µm – 75 µm (0.5 mil – 3.0 mil)
    Cu (in development): 50 µm (2mil)
  • Speed: Up to 7 wires per second, depending on:
    • wire length
    • wire size
    • looping
    • bondhead design (for 45° head only)
  • Bonding force: 15 cN – 150 cN programmable
  • Wedge length: 1″ (for all frequencies)
  • Wear-free and low maintenance components with PIEZO-Technology
  • Free programmable tail length, tear stroke and opening gap of wire clamp
  • High precision touchdown detection without time delay, e.g. for bonding on very thin substrates
  • Precise bondforce control (static and dynamic)
  • High mechanical stiffness of suspension helps eliminate undesired vibrations

Fine Wire Bondhead Deep Access 90°

  • Type: DA04 Bondhead 90° (Deep Access)
  • Frequency: 100 kHz (93.5 kHz); alternative frequencies can be realized by our own transducer construction
  • Wire: Al, Au: 17.5 µm – 50 µm (0.7 mil – 2.0 mil)
    Optional (after consultation): 12.5 µm – 75 µm (0.5 mil – 3.0 mil)
    Cu: 17.5 µm – 30 µm (0.7 mil – 1.2 mil)
    Ribbon: Al, Au: 6 µm x 35 µm (0.25 mil x 1.4 mil) µp to 25 µm x 250 µm (1 mil x 10 mil)
  • Wedge length: 1″ (for all frequencies), >1″ on request
  • Immersion depth: 14 mm diving depth for bonding inside packages with 1″ wedge tool; optional 18 mm with 1.3″ wedge tool
  • Deep access version for bonding ribbon and packages with access limitations
  • Wear free and low maintenance components with PIEZO-Technology
  • Free programmable tail length, tear stroke and opening gap of wire clamp
  • Additional clamp above the transducer for optimized clamping force control
  • High precision touchdown detection without time delay, e.g. for bonding on very thin substrates
  • Precise bondforce control (static and dynamic)
  • Compact design reduces weight and moment of inertia allowing higher accelerations
  • High mechanical stiffness of suspension helps eliminate undesired vibrations
E-Box

Adjustment tool for wire bonders

The E-Box of the Hesse GmbH is a patent-registered visualisation system for control supported, reproducible adjustments of bondhead elements. It includes a camera for optical displaying of wedge, cutter and wire guide as well as a graphical support for adjustment- and positioning control. E-Box allows significant time reduction for setting up the machine. Software enhanced optical adjustment system for wedge, cutter and wire guide / wire clamp.

 

E-Box for Bonder – Advantages during Production

  • Better reproducibility of the adjustment depending attributes (e.g. loop forming) after change of wearing parts
  • Longer life time of wearing parts

 

Advantages for Bond Process

  • System for reproducible set-up of wedge, cutter and wire guide / wire clamp
  • Set-up without microscope
  • Free programmable, specified positions for bondhead elements
    • shown as limitation line
    • different views selectable (different sides, bottom, front etc.)
  • Minimizes time expenditure for set-up work, set-up control and readjustment
  • Process secured adjustment of wire feed elements (wedge, wire clamp, wire guide, cutter etc.)
  • Graphical supported, visual control of
    • wedge and wire guide position
    • distance between wedge and wire clamp
    • gap of wire clamp
    • wire pass
    • cutter respectively cutting position
Process integrated Quality Control system PiQC
 

The Hesse GmbH has implemented a new Process integrated Quality Control system (PiQC) that is unique to the global wire bonding market. A sensor integrated into the Transducer allows for the first time a multi-dimensional signal analysis of the bond process.
PiQC calculates a bond quality index value in realtime, using significant signals from the wire-bonding process.

Advantages for volume production

  • Inspection of every bond
  • No mechanical load of the bond connection
  • Product specific configuration of the quality control system

Feedback from the process

  • Mechanical oscillation of the wedge
  • Friction at bond surface
  • Transducer current
  • Ultrasonic frequency progression
  • Wire deformation

Quality statements by PiQC

  • PiQC calculates a quality index for each bond based on the actual feedback signal from the process
  • The signal related components of the quality index can be displayed graphically at any time

Teach mode for reference data

  • Detailed automatic analysis of the welding process
  • Extraction of process-specific reference data
PBS200 - Wire Bonder Server

The PBS200 Wire Bonder Server is a Windows based system to connect up to 20 Hesse Mechatronics wire bonders at your factory. You can supervise and administrate the machines while production is running. With PBS200 you will have perfect integration of your wire bonders in the production system.
The wire bonders communicate with PBS200 Server over the powerful XML based PBS network protocol.

Features of PBS200

  • „„Backup all the data of all connected wire bonders
  • User Administration and assignment of user accounts to wire bonders or production lines
  • Process Data in real time, ability to store the process data you need and import in Microsoft Excel (Option)
  • Masterprogramming
  • Customization PBS200 can be enhanced according to specific customer requirements for traceability or an MES Server connection (Option). Allow the MES system to decide, what process program is used, store the process results in your MES system. Implement your rework strategy on the Wire Bonders
  • SECS/GEM – compliant module is available for PBS200 (Option)
  • Multi Server: Run multiple PBS200 Servers and administrate all with the PBS Workbench in your office

PBS200 includes

  • PBS200 Client license for one wire bonder
  • PBS200 Hardware with Windows 7 Professional™ and 2 network adaptors
  • PBS200 Server license for one server
  • PBS & PiQC Workbench with USB stick license key

Available Process Data

  • Logbook Data
  • Machine Configuration
  • Important Program Parameters
  • Device ID and Bond Position
  • PiQC Quality Values
  • Deformation and Current Charts
  • Material and Tool Counters
  • Statistical Data
Automation

The precise and safe handling of the products in and out of the production machine plays a significant role in controlling the product quality, yield and efficiency of the production equipment. For this reason Hesse GmbH is offering automation concepts individually adapted for every application.

 

 

 

 

 

 

The portfolio of automation components for our machines consists of the following groups:

  • Indexer / Transport system
  • Bonding Station
  • Magazine Lifts
  • Visualization
  • MES Interface

All our machines are suitable for integration into production lines. This also applies to indexers and magazine lifts, which generally communicate to neighbouring systems by SMEMA interface. The customer specific special solutions which differ from the standard, have lead to some extraordinary optional features, such as:

  • Indexer with automatic rail width adjustment
  • Indexer with tilt function for bonding 3-dimensional MID’s
  • Integrated barcode scanner for automatic program selection
  • Indexer with 2 or 3 rails for parallel AUER boat processing
  • Manual heated workholder with adjustable height for maximum flexibility
  • Magazine lifts with capacity for multiple magazines

Bondjet BJ820 Datasheet

PBS200 Datasheet

E-Box Datasheet