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Bondjet BJ820

High Speed Fully Automatic Fine Wire Wedge Bonder

The Bondjet BJ820 is the world´s leading fully automated fine wire wedge wedge bonder. The BJ820 is ready for all wire bonding challenges on a single platform, using wires and ribbons made of aluminium, copper and gold. Typical applications are components in the HF and RF technology, COB, MCM and hybrids, opto and automotive electronics. The BJ820 defines the latest state of technological development compared to the competition and is benchmark for:

  • The highest bonding speed in the industry
  • The largest working area of fast running fine wire bonders
  • The greatest axis accuracy

Precision

  • High precision touchdown detection without time delay
  • Precise bondforce control (static and dynamic)

Flexibility

  • Largest working area: 305 mm x 410 mm (12″ x 16″)
  • Can serve two or more smaller bonding stations for efficient handling of smaller products or substrates,
  • elimination indexing time and maximization of throughput (with indexers as well as manual loading)
  • Universal software interface for indexer control
  • Enables intelligent automation of extra large products

Speed

  • Up to 7 wires per second, application-dependent,
  • e.g. with parameters25 µm wire, 1 mm loop length, metallized wafer, 127 ms per bond;
  • 2 mm loop length, 134 ms per bond

Quality

  • Continuous real time monitoring of wire deformation, transducer current, frequency and impedance within programmable control limits
  • Piezo bondhead with low maintenance
  • Easy connectivity to Hesse Mechatronics` workbench with modules such as process data and backup system PBS200, PiQC, processdatadrain, Secs/Gem or to standard/custom MES (Manufacturing execution systems)
  • Process integrated Quality Control (PiQC), detection of other parameters by additional sensors (e.g. friction) for 100% quality monitoring in real time (patented)
  • E-Box: patented solution for optimized tool change and programmable alignment marks for wedge and wire clamp

Process Advantages

  • Loop length: 70 µm up to 20 mm (2.8 mil – 800 mil), depending on wire diameter
  • Various loop form functionsConstant wire length
  • Constant loop height
  • Individual loop shapes
  • Fine Pitch 40 µm inline, 25 µm staggered/dual line (depending on wire and loop)

Working area

  • X: 305 mm (12“);  Y: 410 mm (16“);  Z: 30 mm; P: 420°

Mechatronic bondhead

  • BK04 Bondhead 45°, BK04 Bondhead 60
  • DA04 Bondhead 90° (Deep Access)

 
Speed

  • Up to 7 wires per second, application-dependent,
  • e.g. with parameters25 µm wire, 1 mm loop length, metallized wafer, 127 ms per bond;
  • 2 mm loop length, 134 ms per bond

Wire

  • Al, Au: 17.5 µm – 50 µm (0.7 mil – 2.0 mil) (optional heating stage)Optional (after consultation): 12.5 µm – 75 µm  (0.5 mil – 3.0 mil)
  • Cu: 17.5 µm – 30 µm (0.7 mil – 1.2 mil)Cu (in development): 50 µm (3 mil)

Ribbon (Deep Access bondhead)

  • Al, Au: 35 µm x 6 µm (1.4 mil x 0.25 mil) up to 250 µm x 25 µm (10 mil x 1 mil)

Machine dimensions

  • 722 mm x 1250 mm x 1800 mm (W x D x H), height without status lamp

Media connection

  • RJ45 (2 x)
  • Compressed (high-purity)
  • Vacuum
  • 16A AC
  • Digital IOs
  • USB-Port
  • SMEMA

Weight

  • approx. 1350 kg

Fine Wire Bondhead

  • Type: BK04 Bondhead 45°
    Option: BK04 Bondhead 60°
  • Frequency: 100 kHz (93.5 kHz); alternative frequencies can be realized by our own transducer construction
  • Wire: Al, Au: 17.5 µm – 50 µm (0.7 mil – 2.0 mil)
    Optional (after consultation): 12.5 µm – 75 µm (0.5 mil – 3.0 mil)
    Cu (in development): 50 µm (2mil)
  • Speed: Up to 7 wires per second, depending on:
    • wire length
    • wire size
    • looping
    • bondhead design (for 45° head only)
  • Bonding force: 15 cN – 150 cN programmable
  • Wedge length: 1″ (for all frequencies)
  • Wear-free and low maintenance components with PIEZO-Technology
  • Free programmable tail length, tear stroke and opening gap of wire clamp
  • High precision touchdown detection without time delay, e.g. for bonding on very thin substrates
  • Precise bondforce control (static and dynamic)
  • High mechanical stiffness of suspension helps eliminate undesired vibrations

Fine Wire Bondhead Deep Access 90°

  • Type: DA04 Bondhead 90° (Deep Access)
  • Frequency: 100 kHz (93.5 kHz); alternative frequencies can be realized by our own transducer construction
  • Wire: Al, Au: 17.5 µm – 50 µm (0.7 mil – 2.0 mil)
    Optional (after consultation): 12.5 µm – 75 µm (0.5 mil – 3.0 mil)
    Cu: 17.5 µm – 30 µm (0.7 mil – 1.2 mil)
    Ribbon: Al, Au: 6 µm x 35 µm (0.25 mil x 1.4 mil) µp to 25 µm x 250 µm (1 mil x 10 mil)
  • Wedge length: 1″ (for all frequencies), >1″ on request
  • Immersion depth: 14 mm diving depth for bonding inside packages with 1″ wedge tool; optional 18 mm with 1.3″ wedge tool
  • Deep access version for bonding ribbon and packages with access limitations
  • Wear free and low maintenance components with PIEZO-Technology
  • Free programmable tail length, tear stroke and opening gap of wire clamp
  • Additional clamp above the transducer for optimized clamping force control
  • High precision touchdown detection without time delay, e.g. for bonding on very thin substrates
  • Precise bondforce control (static and dynamic)
  • Compact design reduces weight and moment of inertia allowing higher accelerations
  • High mechanical stiffness of suspension helps eliminate undesired vibrations
E-Box
Process integrated Quality Control system PiQC
PBS200 - Wire Bonder Server
Automation

Bondjet BJ820 Datasheet

PBS200 Datasheet

E-Box Datasheet