Max and Max II Series

The dispense systems collectively known as the MAX Series are the premier dispensing platforms in the GPD Global Dispensing line up.

These dispense systems are capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED Encapsulation, and Masks, to name a few.

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If you want to know more about Max and Max II Series

The dispense systems collectively known as the MAX Series are the premier dispensing platforms in the GPD Global Dispensing line up.

These dispense systems are capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED Encapsulation, and Masks, to name a few.

At the heart of all MAX Series systems is a solid unibody with molded frame yielding outstanding stability and unparalleled accuracy.

Standard features include Automatic Vision, Fully Automatic XYZ Needle Calibration with our proprietary backlit calibration station, needle cleaning, surface sensing, and our unique Taper-Lock Pump Mounting hardware. Depending on the MAX Series configuration, a maximum work area of 14.1″ x 12″ (358 mm x 305 mm) is possible.

Each MAX Series system has X,Y positional capability of ± 0.001″ (25 micron) and Z axis repeatability of 0.0003″ (±0.007 mm). Utilizing a GPD Global MAX Series dispense system allows you to expand your process capability to new horizons. Process development is made easy when configured with the Process View Camera that allows the operator to view the dispense process on an external monitor.

For applications that require heat, we offer the MAX II. The ‘II’ signifies heat capability in the work area, an optional nozzle, and material heat. MAX II systems are available in either stand-alone or inline configurations.Substrate heating methods are either: Convection/Forced Air – heat is transferred to the product via an air stream from below the board. This method is preferred when the bottom side of the product has features that are difficult to compensate for with contact fixturing. Contact – Heat is rapidly transferred to the product through direct contact with the product. In most cases, the fixture incorporates vacuum to pull the product to the heated surface for uniform heat transfer.

  • Compact Footprint
  • Unibody Frame
  • Computer Controlled Syringe Pressure
  • Needle Cleaner
  • High Speed, GPD CyclopsTM Vision
  • Automatic Backlit XYZ Calibration Station
  • Up to 2 Valve Capability
  • Accuracy of ±0.001″ (0,025 mm)
  • Speed Up to 38,000 dph with LX Auger Valve
  • Repeatability (per axis) ±0.0152 mm (±0.0006″)
  • Heated worktable up to 200C
  • Heat via Convection/Forced Air or Via Contact
  • Inline Conveyor System or Stand-alone System

 

Application

Pumps / Accessories

High viscosity pastes, glues, adhesives. Precision Auger Pump
High speed, low viscosity. Jetting Pump (NCM5000)

No drip, volumetric repeatability.

Volumetric Pump (PCD)

Simple liquid dispense applications, low-to-mid viscosity..

Time Pressure

Real time process control.

Fluid Pressure Control (FPC) for use with Precision Auger Pump and Jetting Pump (NCM5000) pumps, as well as Time Pressure Dispensing

Max & Max II Series Datasheet