The T-3002-FC3 series is Tresky’s most flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options.
As with all of Tresky’s products, the FC3 incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the FC3 platform is the industry’s most sophisticated system in its class.
The T-3002-FC3 is equiped with Tresky’s die ejector system for pick-up from wafer.