- Flexible, fully automatic die attach system controlled by user friendly Windows based software.
- The system is available either installed on its own bench or in “Table-Top” configuration (without bench).
- Model 6400 performs cold and hot processes for MCM, Flip Chip, Eutectic, and Ultrasonic assemblies.
- Very high placement accuracy of 3 microns @ 3 sigma (process dependent) is ensured by the closed loop servo systems and the high resolution digital vision system
- Handles active and passive components with sizes between 0.2 mm up to over 25 mm.
- Pick from up to thirty 2″ or up to nine 4″ Waffle or Gel Pak carriers.
- Pick from Wafers up to 300 mm
- Pick from up to 12 Tape & Reel feeders.
- Specializing in unusual die sizes and aspect ratios.
- The volumetric or time-pressure dispenser applies adhesive in programmable shapes.
- Stamping (Pin Transfer) applies adhesive dots as small as 75 microns.
- Full Flip Chip capability including chip flipping, bump fluxing and chip final alignment over up looking camera.
- Handles CCD and other sensors, LCD’s, MEMS and other sensitive devices
- Unique die staking capability with programmable BLT.
