ADT Wafer Mounting System 966 enable mounting of wafers/substrates to frames using various kinds of tapes.
Mounting solutions to match your specific needs
The systems are offered in two basic configurations:
- WM-966 – up to 8″ wafer
- WM-966LA – up to 12″ wafer.
System Highlights:
- Uniform mounting without air bubbles
- Build-in reeling and removal of UV tape backing
- Mounting plate temperature control
- Compatibility with all film frames; linear and circular tape cutting
Custom-made chucks for special requirements:
- Thin wafers
- Sensitive surface
- Multiple panels
Options:
- ESD protection
- Tape saving mechanism
