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Manual Wafer Mounter 966

ADT Wafer Mounting System 966 enable mounting of wafers/substrates to frames using various kinds of tapes.

Mounting solutions to match your specific needs

The systems are offered in two basic configurations:

WM-966 – up to 8″ wafer
WM-966LA – up to 12″ wafer.

ADT Wafer Mounting System 966 enable mounting of wafers/substrates to frames using various kinds of tapes.

Mounting solutions to match your specific needs

The systems are offered in two basic configurations:

  • WM-966 – up to 8″ wafer
  • WM-966LA – up to 12″ wafer.

System Highlights:

  • Uniform mounting without air bubbles
  • Build-in reeling and removal of UV tape backing

  • Mounting plate temperature control
  • Compatibility with all film frames; linear and circular tape cutting

Custom-made chucks for special requirements:

  • Thin wafers
  • Sensitive surface
  • Multiple panels

Options:

  • ESD protection
  • Tape saving mechanism

 

  Model 966 – 8″ Model 966 – 12″
Max.  wafer size Ø 200 mm* Ø 300 mm*
Max. tape width 300 mm 400 mm
Plate heating Up to 80°C Up to 80°C
Machine dimensions (WxDxH) 304 x 800 x 394 mm 330 x 1000 x 560 mm
Approx. machine weight 30 kg 60 kg

** Refers to standard models.

ADT Manual Wafer Mounter System 966 Brochure

ADT Peripheral Equipments