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ADT 7900 Series

Cope with your Production Challenges

The growing market and the ongoing demand to lower the cost of production per unit (CoO) drived ADT to launch the 7900 series

Description

Cope with your Production Challenges

The growing market and the ongoing demand to lower the cost of production per unit (CoO) drived ADT to launch the 7900 series.

 

The main advantages of the 7900 series:

  • Simplicity
  • Automation
  • Ease of use
  • New generation of graphic user interface (GUI)
  • Small foot print systems

Model 7910 Uno

As part of the growing market and the ongoing demand to lower the cost of production per unit (CoO), ADT has responded with a single spindle system model 7910 Uno.

The 7910 Uno system provides a perfect solution for standard silicon wafers up to 8” and for low cost discrete devices.

Further to the automatic vision and easy Graphic User Interface (GUI), ADT is offering a machine at small foot print for saving cost on the production floor.

7910 Series Advantages:

  • Up to 8” wafer
  • Fast automatic alignment and cut positioning increase throughput
  • Automatic Kerf inspection increase yield
  • Automatic Y offset correction ensures maximum precision
  • Single low vibration spindle enable superb cut quality
  • Friendly and intuitive GUI
  • Touch screen user interface
  • Easy to load and unload
  • Easy to maintain
  • Small footprint reduces cost of ownership
  • Price
Model 7132

As part of the growing market of the LED segment and the on going demand to lower the cost of production per unit (CoO), ADT has responded with a dual spindle system model 7900 Duo that double the productivity while maintaining the same current production floor space.

The 7900 Duo system provides a perfect solution for applications that require a long cut cycle time such as image sensors and saw devices.

Further to the automatic vision and easy Graphic User Interface (GUI), ADT is offering a unique feature for processing and programming of broken wafers.

7900 Series Advantages:

  • Two facing spindles enable simultaneous dicing
  • Low vibration platform
  • Fast automatic alignment and cut positioning increase throughput
  • Small footprint reduces cost of ownership
  • Automatic Kerf inspection increase yield
  • Automatic Y offset correction ensures maximum precision
  • Tape surface detection ensures consistent cut quality
  • Touch screen user interface

System Specifications

  • Work piece size: 6″ x 6″ or 8″ x 8″
  • Blade size: 2″- 3″
  • Spindle: Two facing spindle, 60 krpm, 2.5 kW and rated torque of 0.25 Nm

Y1/Y2 Axis

  • Drive: Ball bearing lead screw with stepper motor
  • Control: linear encoder
  • Resolution: 0.2 µm
  • Cumulative accuracy: 1.5 µm
  • Indexing accuracy: 2.0 µm
  • Cutting range: 160mm (6″ x 6″)  /  200mm (8″x8″) 

X Axis

  • Drive: Ball bearing lead screw
  • Air bearing slide
  • Feed rate: up to 600 mm/sec
  • Cutting range: 410mm

Z1/ Z2 Axis

  • Drive: Ball bearing lead screw
  • Resolution: 0.2 µm
  • Accuracy: 2.0 µm
  • Repeatability: 1.0 µm
  • Stroke: up to 25mm

Ø  Axis

  • Drive: closed-loop, direct-drive
  • Accuracy: 4 arc-sec
  • Repeatability: 4 arc-sec
  • Stroke: 350 deg.

Vision System

  • Digital camera, Fire wire link
  • High bright LED illumination (vertical & oblique)

Utilities

  • Electrical: 200-240 VAC 50/60 Hz, Single phase
  • Air consumption: 260 L/min @ 5.5 bar
  • Cutting water (per spindle): 3 L/min
  • Spindle water (per spindle): 1.1 l/min

Dimensions (WxDxH):

  • 875 x 975 x 1450 mm
  • Weight: 900 kg

Features

  • Automatic alignment
  • Automatic Kerf inspection
  • Automatic Y offset correction
Model 7900 Duo LA (Large Area)

7900 Duo LA (LArge Area)

 ADT can provide the 7900 Duo dicing machine with large area cutting capabilities of up to 8” X 10” or 10” X 10”.

The 7900 Duo LA supports multi panels for high throughput.

Dicing Floor Management (DFM)

DFM system is a software and hardware option based on SECS/GEM* communication protocol that collects data and monitors all dicing saw machines at the production floor.

The DFM system will generate detailed reports such as UPH, up time, production data and other useful information for the production managers and is also of great value to your customers who demand data tracking.

Full barcode capability is embedded in the system for operator simplicity.

The DFM system will support up to 30 ADT different dicing saw machines.

The main advantages:

  • Transparency & real time visibility of the production floor
  • Progressive production monitoring
  • Monitoring the production efficiency
  • Tracking operator performances
  • Increasing productivity
  • Increased reliability and quality
  • Easy to file reports (daily, weekly and monthly)
  • Blade inventory management
  • Recipe backups
  • Capability to transfer recipe between the systems
Coating De-coating system

Many applications, as MEMS devices and Optic components, are sensitive to the environment developed during the dicing process.To protect the wafer during the dicing process, avoiding component damage, ADT has developed an option which coats the wafer with a very thin film of a transparent coating material before the dicing process, later removed as part of the wafer cleaning process.
Dressing Procedure

ADT has developed a new software feature that provides the ability to ‘dress and drag’ (Y axis moves forward at a programmed speed dragging the blade into the dress material) the blade to maintain a flat edge on the dicing blade instead of a standard “dicing” methods on a dress block.

This feature is available on the new 7120 / 7130 / 7220 dicing machines.

Field retrofit is available.

Tapeless 7134 dicing saw

ADT has recently completed a new project for dicing in a tapeless process mode. The work piece is placed on a formal rubber pad with vacuum holes, holding the workpiece and diced parts in place during the dicing process without the use of dicing tape.

To create a high level of vacuum on the tapeless dicing chuck, the dicing machine is configured with a special high level vacuum pump and a special large water separator.

The above solution is also available on the 7122 / 7132 / 7124 dicing systems, including the possibility of supporting small dies.

Barcode Reader


The dicing saws support the option of adding a Barcode reader.
On the semi-automatic dicing machines (7120 / 7130) the barcode reader is external while on the automatic dicing saws (7220) the barcode reader is internal.

This option supports various types of barcodes that can be read from the frame, from the cassette or from a paper.

Scrap Removal

The Scrap Removal kit was designed for customers dicing applications that create a lot of dirt and/or want to filter and manage the cutting waste.
This kit includes a surface that guides the water and diced remaining to a tank before going to the drain.

*This option is available with orders of new dicing machines only.


ADT 7900 Duo & Uno Datasheet

ADT 7900 Brochure

ADT 7910 Uno Product Specifications