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ADT 8230 Series

Fully Automatic Twin Dicing System

The ADT 8230 Dicing Saw has two facing spindles that can simultaneously dice wafers at high throughput.

ADT 8230 is a high accuracy system that can dice workpieces of up to 12-inches maximum workpiece size, at high performances and low cost of operation

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The ADT 8230 is a high-efficiency, high-precision, high-performance and low-cost fully automatic twin-spindle dicing machine with up to 12 inches maximum workpiece size.

Ease of Use

The 8230 operates with the ADT intuitive New graphic User Interface (GUI), and the monitor screen is a 17″ touch-screens with better flexibility and visual effects.

Features and Benefits

  • Flexibility – Supports Hub and Hubless blades up to 3″.O.D
  • Spindles of 1.8 kW or 2.2 kW high power (for challenging applications)
  • Intuitive operation interface using a large 17″ touch screen monitor

Leading Applications

  • Silicon wafers discrete devices
  • Silicon carbide (SiC)
  • MEMS
  • SAW devices
  • Glass wafer
  • Packaging (QFN, LED…)

Other Key Features of Importance

  • Highest Dicing Process Speeds – Lowest Cost
  • Air spindle
  • Fast automatic alignment and cut positioning for increased throughput
  • Automatic Kerf check and quality analysis for maximum precision
  • Process data logging and statistical analysis
  • Fast & Simple Blade Change with a locking spindle shaft
  • SECS / GEM platform ready
  • Full access to any area of the system for easy maintenance access
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ADT 8230 Series Datasheet

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