| Product | Product group | Strong points | One komponent or two komponents | Color | Viscosity | Cure | Storage | Thyxotropie |
|---|---|---|---|---|---|---|---|---|
| IQ-BOND 1402-WHLV | Underfill encapsulants | White reflective underfill; fast cure | 1 K | White | low | Fast @ High temperature | 4 months @ 5°C; 12 months @ -20°C | Low |
| IQ-BOND 2175 | Underfill encapsulants | Very low viscosity, for very small bondlines < 5 µm | 1 K | Clear | low | Fast @ Low temperature | 12 months @ -40°C | Low |
| IQ-BOND 2176 | Underfill encapsulants | High Tg; low viscosity underfill for high temperature applications | 1 K | White | Low | Other | 12 months @ -40°C | Low |
| IQ-BOND 2177 | Underfill encapsulants | Thermally conductive underfill, thermal conductivity: 0,8-0,9 W/m.K) | 1 K | White | Low | Other | 12 months @ -40°C | Low |
| IQ-BOND 2409 | Underfill encapsulants | Low viscous, fast cure underfill adhesive, very long potlife | 1 K | Black | Low | Fast @ High temperature | 4 months @ 5°C; 12 months @ -20°C | Low |
| IQ-BOND 2409-LV | Underfill encapsulants | Lower viscosity version of IQ-BOND 2409 for improved flow | 1 K | Black | Low | Fast @ High temperature | 5 months @ < 5°C; 12 months @ -20 | Low |
| IQ-BOND 2472 | Underfill encapsulants | Low viscosity | 1 K | White | Low | Fast @ High temperature | 4 months @ 5°C; 12 months @ -20°C | Low |
| IQ-BOND 2472-LV | Underfill encapsulants | Lower viscosity version of IQ-BOND 2472, for improved flow | 1 K | White | Very Low | Fast @ High temperature | 4 months @ 5°C; 12 months @ -20°C | Low |
| IQ-BOND 2473 | Underfill encapsulants | Low viscosity | 1 K | White | Very Low | Fast @ High temperature | 4 months @ 5°C; 12 months @ -20°C | Low |
| IQ-BOND 2473-LV | Underfill encapsulants | Low Viscosity | 1 K | Black | Very Low | Fast @ High temperature | 4 months @ 5°C; 12 months @ -20°C | Low |
| IQ-BOND 2476 | Underfill encapsulants | Low CTE, NASA certified (meets NASA outgassing standards), high glass transition temperature combined with low thermal expansion | 1 K | White | Medium | Medium @ High Temperature | 6 months @ -40°C | Low |
| IQ-BOND 2481 | Underfill encapsulants | high reliability, thermal cycling from -65°C up to 200°C possible | 1 K | Black | Medium | 3 months @ -20°C; 6 months @ -40°C | Medium | |
| IQ-BOND 2178 | Underfill encapsulants | resists temperatures over 200°C | 1 K | Milky – Beige | Medium | 6 months @ -40°C | Low |
Underfill encapsulants
Underfills are typically epoxy-based materials which are used in electronic assemblies to fill the gap between BGA-, CSP- or flipchip-components and the printed circuit board. As such, these components are protected against shock, drop, thermal-cycling and vibration impact.
Roartis® offers a range of capillary underfills with unique features such as high Tg, low CTE and good flow, even for very small gap applications.
Quick Enquiry
If you want to know more about Underfill encapsulants
