Sintering Materials

Thermoset hybrid-sintering epoxy based adhesives or Silver-based Sintering Paste for high power die attach applications. It offers the combination of high temperature resistance, combined with best-in-class thermal and electrical conductivity. Typical applications include power semiconductors, high-brightness LED’s, automotive EV power modules, RF devices, laser-diodes, solder replacement, concentrator solar cells, etc.

Despite the high filler loading, these materials have a relatively low viscosity. As such, the rheology is ideally suited for small dot dispensing & stamping.

Currently our sintering materials are silver based but we are working on other technologies, please contact us for more information.

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Product Product group Strong points Color Viscosity Cure Work life
IQ-BOND 5450-HSCE Hybrid sinter paste High speed, fine dot dispensing High thermally & electrically conductivity (> 60 W/m.K , 9 x 10-6 Ohm.cm) Silver 20.000 mPa.s Multiple stage cure: 15 min @ 120°C + Ramp 15 min to 200°C 12 hrs
IQ-BOND 5451-HSCE Hybrid sinter paste High speed, fine dot dispensing Higher viscosity & improved electrically conductivity version of IQ-BOND 5450-HSCE (> 60 W/m.K , 3,8 x 10-6 Ohm.cm) Silver 45.000 mPa.s Multiple stage cure: 15 min @ 120°C + Ramp 15 min to 200°C 12 hrs
IQ-SINTER 5460 Sinter paste High thermally & electrically conductive (> 200 W/m.K , 4 x 10-6 Ohm.cm) Both suitable both for “Pressureless”, as well as “Pressure Assisted” Sintering Silver 53.000 mPa.s Pressure assisted: air dry 10 min @ 200°C + sinter 5 min @ 250°C / Pressureless: 1 hr @ 200°C 24 hrs
IQ-SINTER 5461 Sinter paste High thermally & electrically conductive (> 200 W/m.K , 5 x 10-6 Ohm.cm) Both suitable both for “Pressureless”, as well as “Pressure Assisted” Sintering Silver 160.000 mPa.s Pressure assisted: air dry 10 min @ 200°C + sinter 5 min @ 250°C / Pressureless: 1 hr @ 200°C 12 hrs

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