| Product | Product group | Strong points | One komponent or two komponents | Color | Viscosity | Cure | Thermal conductivity | Storage | Thyxotropie |
|---|---|---|---|---|---|---|---|---|---|
| IQ-BOND 2280 | Glob Top Encapsulant | 80°C cure, needles for dispinsing of >400µm | 1 K | Black | Medium | Fast @ High temperature; Medium @ Medium temperature | 6 months @ <5°C | Medium | |
| IQ-BOND 2504 | Glob Top Encapsulant | Non-flow/non-sagging, dispensable, suitable for thermal cycling requirements from -65°C up to + 160°C | 1 K | Black | Very High | Other | 3 months @ -20°C; 6 months @ -40°C | High | |
| IQ-BOND 2505 | Glob Top Encapsulant | Slightly less thyxotropic version of IQ-BOND 2504 | 1 K | Black | TBD | Other | 3 months @ -20°C; 6 months @ -40°C | High | |
| IQ-BOND 2512 | Glob Top Encapsulant | Thermal cycling requirements from -65°C up to +160°C, dispensable, use in combination with IQ-BOND 2504 possible | 1 K | Black | Low | Other | 3 months @ -20°C; 6 months @ -40°C | Medium | |
| IQ-BOND 2513 | Glob Top Encapsulant | Lower viscous, smaller particle size, improved flowability version of IQ-BOND 2512 | 1 K | Black | Low | Other | 3 months @ -20°C; 6 months @ -40°C | Medium | |
| IQ-BOND 2514 | Glob Top encapsulant | Lower viscous, smaller particle size, improved flowability version of IQ-BOND 2512 and 2513, optimized for applications where flow is required | 1 K | Black | Low | Other | 3 months @ -20°C; 6 months @ -40°C | Low | |
| IQ-BOND 2515 | Glob Top Encapsulant | Lower shrinkage, higher filler loading version of IQ-BOND 2514 | 1 K | Black | Medium | 60 min @ 165°C | 3 months @ -20°C; 6 months @ -40°C | Low | |
| IQ-BOND 2516 | Glob Top Encapsulant | Small particles, high filler loading with thyxotropic behavior during dispensing process, curing cycling requirements from -65°C up to +160°C | 1 K | Black | Medium | Other | 3 months @ -20°C; 6 months @ -40°C | ||
| IQ-BOND 2517 | Glob Top Encapsulant | Non-Bleeding, exceptional reliability performance in harsh environment, dispense applications | 1 K | Black | Medium | Other | 3 months @ -20°C; 6 months @ -40°C | Medium | |
| IQ-BOND 2538 | Glob Top encapsulant | Dispensing, printing, stamping processes, high adhesion strength, allows temperatures between – 50°C and +200°C | 1 K | Black | Very High | Other | 0,5 | 6 months @ -20°C; 12 months @ -40°C | High |
| IQ-BOND 7292 UV | UV-Acrylate, Glob Top | One component, medium viscosity, medium thixotropy, epoxy-based, UV-curable GLOB-TOP adhesive | 1 K | White | Medium | ~30 seconds at 120 mW/cm² for a 500 μm thick layer (UV-A) | 4 months @ 5°C; >6 months @ -20°C | Medium |
Glob top – Dam and Fill encapsulants
In many electronic assemblies, sensitive components, such as bare Si dies, crystal oscillators RF components, BGA’s and CSP’s require reliable protection against harsh environments.
Roartis® epoxy-based “glob top” and “dam & fill” resins with high Tg and low CTE are used in demanding applications where customers require thermal cycling resistance between -55°C up to 180°C. Also extensive humidity storage testing (2000hrs 85°C/85%RH) has proven to be no obstacle for Roartis® “glob top” or “dam & fill” materials.
Where “dam & fill” encapsulants are typically used for larger die applications, “glob top” encapsulants are mostly used for smaller chips. To minimize the process time, the chemistry of the “dam & fill” encapsulants has been optimized to enable a co-cure process.
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