Micro Electronics Workshop 8th February 2018 in Eindhoven
With the ever increasing integration and miniaturisation in micro electronics assembly and the high demand for short time-to-market products, the need for flexible and cost-effective assembly and inspection solutions is eminent.
During this workshop you will discover our solutions for die bonding, wire bonding, surface metrology, bond testing and inspection with X-Ray.
Date: 8th February 2018
Location: Accelonix Eindhoven
Keep up to date with the latest solutions in the field of micro electronics assembly and inspection.
During this workshop you will discover our equipment for die bonding, wire bonding, bond testing, surface metrology and X-ray inspection.
At this event you will be able to meet our new partners DR TRESKY and CYBER Technologies!
Following assembly and inspection systems will be demonstrated:
- TRESKY T4909 Die Bonding & Flipchip
- Royce 650 Pull and shear testing
- CYBER Technologies CT100 surface measurement
- Yxlon Cheetah X-ray & CT inspection system
- TPT HB16 semi automatic wire bonder
We hope to welcome you in Eindhoven!
Free lunch and refreshments are included.
For free registration please fill in the registration form in the next tab on this page.