Introducing the New ADT 6200 Compact Automatic Dicing System

High Performance. Small Footprint. Low Cost of Ownership.

We are pleased to introduce the new ADT 6200 Compact Automatic Dicing System – a compact 6-inch dicing solution designed for customers looking for precision, reliability and affordability without compromising process quality.

Built on ADT’s proven dicing technology, the 6200 combines a space-saving design with automatic alignment, cutting and kerf check inspection. Its 2.2 kW air-bearing spindle, user-friendly software interface and 17-inch touchscreen support accurate and efficient processing across a wide range of applications.

The ADT 6200 is suitable for R&D, universities and production environments, with applications including silicon wafers, compound semiconductors such as GaAs, InP and SiC, MEMS, optical components, ceramics, glass, package singulation and other microelectronic devices.

With a focus on low total cost of ownership, the system offers a compelling combination of a lower initial investment, low utility consumption, long service life and reliable operation.

As part of the introduction, attractive package solutions are available, including dicing blades and complementary wafer-processing equipment.

Interested in the ADT 6200? Contact us to discuss your application and the available solutions.

More product information will follow shortly, meanwhile the datasheet is avaibale for download below: